1、整理IPC标准文件一览表0514IPC标准、文件一览表颜色一: 老江买的,有纸制件(总25本,23个标准,有部分同以前重复)颜色二: 蔡卫东搜集的,电子件黑色:暂缺Updated May 24, 2000IPC DOC #(IPC文件号)TITLE名称PUBLICATION/REVISION DATES出版/修订日期Roadmap(指南)National Technology Roadmap for Electronic Interconnections(美国国家电子互联技术指南)6/95 (orig. pub.)SMC-TR-001SMT An Introduction to Tape Au
2、tomated Bonding & Fine Pitch Technology(TAB和细间距SMT介绍)1/89 (orig. pub.)J-STD-001 代替 IPC-S-815 Requirements for Soldered Electrical and Electronic Assemblies(电气、电子组件焊接技术要求)4/92 (orig. pub.)Revision: A 1/95Amendment 1: 3/96Revision B: 10/96Revision C: 3/00IPC-HDBK-001Handbook and Guide to the Requireme
3、nts for Soldered Electrical and Electronic Assemblies to Supplement J-STD-001B(J-STD-001B学习辅导书)3/98 (orig. pub.)J-STD-002 代替 IPC-S-805 Solderability Tests for Component Leads,Terminations, Lugs, Terminals and Wires (元件引线,焊端,接线端和导线的可焊性测试)4/92 (orig. pub.)A 10/98J-STD-003 代替 IPC-S-804 Solderability Te
4、sts for Printed Boards(印制板可焊性测试)4/92 (orig. pub.)Revision A: In process J-STD-004 代替IPC-SF-818 Requirements for Soldering Fluxes(助焊剂技术要求)1/95 (orig. pub.)Amendment 1 - 4/96Revision A: In processJ-STD-005 代替 IPC-SF-819 Requirements for Soldering Pastes(焊膏技术要求)1/95 (orig. pub.)Amendment 1 - 1/95J-STD-
5、006Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications(电子级固态焊料技术要求)1/95 (orig. pub.)Amendment 1 - 6/96Revision A: In processJ-STD-012Implementation of Flip Chip and Chip Scale Technology(FC和CSP器件的安装)1/96 (orig. pub.)J-STD-013I
6、mplementation of Ball Grid Array and Other High Density Technology(BGA和HDI器件的安装)7/96 (orig. pub.)IPC-DRM-18Component Identification Desk Reference Manual(元器件封装辨认手册)9/95 (orig. pub.)Revision A: 4/96Revision B: 2/97Revision C: 7/98J-STD-020Moisture/Reflow Sensitivity Classification of Plastic Surface
7、Mount Devices(塑封表面器件对潮湿和再流焊的敏感度要求)October 1996 (orig. pub.)Revision A: 3/99IPC-DRM-40Through-Hole Solder Joint Evaluation Desk Reference Manual(通孔引线焊点评估参考手册)IPC-DRM-SMTSurface Mount Solder Joint Evaluation Desk Reference Manual (表面组装焊点评估参考手册)8/98IPC-T-50Terms and Definitions Interconnecting and Pack
8、aging Electronic Circuits(电子电路互连及封装术语和定义)8/75 (orig. pub.)A - 8/76B - 6/80C - 3/85D - 11/88E - 7/92F - 6/96IPC-SC-60Post Solder Solvent Cleaning Handbook (焊后溶剂清洗手册)4/87 (orig. pub.)Revision A: In processIPC-SA-61Post-Solder Semi-Aqueous Cleaning Handbook(焊后半水清洗手册)7/95 (orig. pub.)IPC-AC-62Post Solde
9、r Aqueous Cleaning Handbook (焊后水清洗手册)12/86 (orig. pub.)IPC-CH-65Guidelines for Cleaning of Printed Boards and Assemblies(印制板及其组件清洗导则)（5）公众意见采纳与不采纳的合理性；12/90 (orig. pub.)Revision A: In processIPC-CS-70Guidelines for Chemical Handling Safety in Printed Board Manufacturing(印制板制造化学处理安全准则)（二）安全评价的基本原则8/8
10、8 (orig. pub.)价值=支付意愿=市场价格消费量+消费者剩余IPC-MP-83IPC Policy on Metrication(IPC公制化导则)安全评价是落实“安全第一，预防为主，综合治理”方针的重要技术保障，是安全生产监督管理的重要手段。8/85 (orig. pub.)（1）规划实施后实际产生的环境影响与环境影响评价文件预测可能产生的环境影响之间的比较分析和评估；IPC-PC-90General Requirements for Implementation of Statistical Process Control(实施SPC的总技术规范)3.完整性原则；10/90 (o
11、rig. pub.)IPC-QS-95（4）跟踪评价的结论。General Requirements for Implementation of ISO 9000 Quality Systems(实施 ISO 9000质量体系的总技术规范)四、安全预评价4/93 (orig. pub.)建设项目所处环境的敏感性质和敏感程度是确定建设项目环境影响评价类别的重要依据，环境影响评价文件应当就该项目对环境的影响做重点分析。IPC-L-125Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency
12、 Interconnections(高速/高频塑性基板特性规范)一、环境影响评价的发展与管理体系、相关法律法规体系和技术导则的应用8/83 (orig. pub.)A 7/92IPC-EG-140Specification for Finished Fabric Woven from E Glass for Printed Boards(E纤维织物印制板特性规范)3/88 (orig. pub.)A 6/97*IPC-SG-141Specification for Finished Fabric Woven from S Glass for Printed Boards (S纤维织物印制板特性
13、规范)2/92 (orig. pub.)IPC-A-142Specification for Finished Fabric Woven from Aramid for Printed Boards(Aramid纤维织物印制板特性规范)6/90 (orig. pub.)IPC-QF-143General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards(石英纤维织物印制板特性规范)2/92 (orig. pub.)IPC-CF-148Resin Coated Me
14、tal for Printed Boards (印制板涂树脂金属箔)6/90 (orig. pub.)A 9/98IPC-MF-150Metal Foil for Printed Wiring Applications(印制线路金属箔)8/66 (orig.pub.) A 9/67 B 2/71 C 8/74 D 3/76 E 5/81 F 10/91 , 8/92G 5/99IPC-CF-152Composite Metallic Material Specification for Printed Wiring Boards (印制板复合金属材料特性规范)6/90 (orig. pub.)
15、A 1/94B 3/98IPC-FC-231Flexible Base Dielectrics for Use in Flexible Printed Wiring (柔性印制线路的绝缘基材)orig. pub. 7/74 A 5/83B 2/86C 4/92 Amendment 10/95IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的绝缘基材)7/74 (orig. pub.)A 5/83B 2/86C 4/92Amendmen
16、t 10/95IPC-FA-251Guidelines for Single and Double Sided Flex Circuits (单、双面柔性电路指南)2/92 (orig. pub.)IPC-D-279Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies(可靠的印制板SMT设计指南)7/96 (orig. pub.)IPC-D-300Printed Board Dimensions and Tolerances(印制板的尺寸和容差)8/60 (orig. pub.)A 7/
17、61B 1/64C 10/65D 1/70E 10/70F 11/74 Editorial revisionG 1/84 IPC-D-310Guidelines for Phototool Generation and Measurement Techniques (照相底板生成和测量技术指南)9/69 (orig. pub.)A 12/77B 12/85C 06/91IPC-A-311Process Control Guidelines for Phototool Generation and Use(照相底板生成和使用过程的控制指南)3/96 (orig. pub.)IPC-D-316De
18、sign Guide for Microwave Circuit Boards Utilizing Soft Substrates (软质基材的微波电路设计指南)5/95 (orig. pub.)IPC-D-317Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques(电子封装用于高速技术的设计指南)4/90 (orig. pub)A 1/95IPC-D-322Guidelines for Selecting Printed Wiring Board Sizes Using Standard Pane
19、l Sizes(拼板中印制板迭用尺寸指南)8/84 orig. pub.Reaffirmed 9/91IPC-MC-324Performance Specifications for Metal Core Boards(金属芯电路板性能规范) 10/88 (orig. pub.)IPC-D-325Documentation Requirements for Printed Boards, Assemblies and Support Drawings (印制板、组件和支撑件图纸文件要求)1/87 (orig. pub.)A 5/95IPC-D-326Information Requiremen
20、ts for Manufacturing Printed Board Assemblies(印制板组装制造的文件资料要求)4/91 (orig. pub.)IPC-D-330Design Guide Manual(设计指导手册)IPC-NC-349Computer Numerical Control Formatting for Drillers and Routers(钻孔和布线器的计算机控制数据格式) 8/85 (orig. pub.)IPC-D-350Printed Board Description in Digital Form(印制板的数字化表述)8/72 (orig. pub.)
21、A 2/75B 8/77C 10/85 ReaffirmedD7/92 Technical Content Identical to IEC-1182-1IPC-D-351Printed Board Drawings in Digital Form(印制板图形的数字化表述)8/85 (orig. pub.)IPC-D-352Electronic Design Data Description for Printed Boards in Digital Form (印制板电子设计数椐的数字化表述)8/85 (orig. pub.)IPC-D-354Library Format Descripti
22、on for Printed Boards in Digital Form (印制板文件格式的数字化表述)2/87 (orig. pub.)IPC-D-355Printed Board Assembly Description in Digital Form(印制板组件的数字化表述)1/95 (orig. pub.)IPC-D-356Bare Board Electrical Test Information in Digital Form (印制裸板电测信息的数字化表述)3/92 (orig. pub.)A 1/98IPC-MB-380Guidelines for Molded Interc
23、onnection Devices (模制器件互连指南)10/90 (orig. pub.)IPC-D-390Automated Design Guidelines(自动设计指南)7/74 (orig. pub.)A 2/88IPC-C-406Design and Application Guidelines for Surface Mount Connectors (表面组装连接器设计和应用指南)1/90 (orig. pub.)IPC-CI-408Design and Application Guidelines for the Use of Solderless Surface Moun
24、t Connectors(非焊接表面组装连接器设计和应用指南) 1/94 orig. pub.IPC-BP-421General Specification for Rigid Printed Board Backplanes with Press-Fit Contacts(带压接连接器的刚性印制背板通用技术规范)10/80 (orig. pub.)Reaffirmed 4/90IPC-D-422Design Guide for Press Fit Rigid Printed Board Backplanes(刚性压接印制背板设计指南)9/82 (orig. pub.)IPC-DW-424Ge
25、neral Specification for Encapsulated Discrete Wire Interconnection Boards(印制板分立包皮导线互连通用技术规范)1/95 (orig. pub.)IPC-DW-425Design and End Product Requirements for Discrete Wiring Boards(分立线路板设计和成品技术规范)9/82 (orig. pub.)A 5/90IPC-DW-426Specifications for Assembly of Discrete Wiring (分立线路组装技术规范)12/87 (orig
26、. pub.)IPC-TR-460Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards (印制板波峰焊故障检查表)1973 (orig. pub) A 2/84IPC-TR-461Solderability Evaluation of Thick and Thin Fused Coatings(厚、薄热涂层的可焊性评估) 3/79 (orig. pub.)IPC-TR-462Solderability Evaluation of Printed Boards with Protective Coatings Ov
27、er Long Term Storage(具有持效保护涂层的印制板可焊性评估)10/87 (orig. pub.)IPC-TR-464Accelerated Aging for Solderability Evaluations (可焊性的加速老化评估)orig. pub.4/84A 12/87IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability(恒温蒸汽老化的联合测试报告)1993IPC-TR-465-2The Effect of Steam Aging Time and Temperature on
28、 Solderability Test Results (蒸汔老化时间和温度对可焊性测试结果的影响)1993IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase IIA( 对不同处理剂的蒸汽老化评估,Phase IIA)7/96IPC-TR-466Wetting Balance Standard Weight Comparison Test(润湿平衡标准称重比较测试)4/95 (orig. pub.)IPC-TR-467Supporting Data and Numerical Examples for ANS
29、I/J-STD-001 Appendix D(ANSI/J-STD-001附件D的支持数据和数字举例)10/96 (orig. pub.)IPC-TR-468Factors Affecting Insulation Resistance Performance of Printed Boards(印制板绝缘电阻的影响因素)3/79 (orig. pub.)IPC-TR-470Thermal Characteristics of Multilayer Interconnection Boards(多层互连板的热特性) 1/74 (orig. pub.)IPC-TR-474An Overview
30、of Discrete Wiring Techniques(分立线路综观)3/79 (orig. pub.)Reprint 1984IPC-TR-476How to Avoid Metallic Growth Problems on Electronic Hardware(如何避免电子硬件的合金化生长)9/77 (orig. pub.)A 6/84IPC-TR-481Results of Multilayer Test Program Round Robin V (多层V循环测试程序的结果)4/81 (orig. pub.)IPC-TR-483Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄层压板尺寸稳定性测试- )4/84 (orig. pub.)10/87 AddendumsRevised 3/91IPC-TR-484Results of IPC Cooper Foil Ductility Round Robin Study(IPC Cooper 箔延展性研究联合报告)
