整理IPC标准文件一览表0514.docx
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整理IPC标准文件一览表0514.docx
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整理IPC标准文件一览表0514
IPC标准、文件一览表
颜色一:
老江买的,有纸制件(总25本,23个标准,有部分同以前重复)
颜色二:
蔡卫东搜集的,电子件
黑色:
暂缺
UpdatedMay24,2000
IPCDOC#
(IPC文件号)
TITLE
名称
PUBLICATION/
REVISIONDATES
出版/修订日期
Roadmap
(指南)
NationalTechnologyRoadmapforElectronicInterconnections
(美国国家电子互联技术指南)
6/95(orig.pub.)
SMC-TR-001
SMTAnIntroductiontoTapeAutomatedBonding&FinePitchTechnology(TAB和细间距SMT介绍)
1/89(orig.pub.)
J-STD-001
代替IPC-S-815
RequirementsforSolderedElectricalandElectronicAssemblies
(电气、电子组件焊接技术要求)
4/92(orig.pub.)
Revision:
A1/95
Amendment1:
3/96
RevisionB:
10/96
RevisionC:
3/00
IPC-HDBK-001
HandbookandGuidetotheRequirementsforSolderedElectricalandElectronicAssembliestoSupplementJ-STD-001B
(J-STD-001B学习辅导书)
3/98(orig.pub.)
J-STD-002
代替IPC-S-805
SolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires(元件引线,焊端,接线端和导线的可焊性
测试)
4/92(orig.pub.)
A10/98
J-STD-003
代替IPC-S-804
SolderabilityTestsforPrintedBoards(印制板可焊性测试)
4/92(orig.pub.)
RevisionA:
Inprocess
J-STD-004
代替IPC-SF-818
RequirementsforSolderingFluxes(助焊剂技术要求)
1/95(orig.pub.)
Amendment1-4/96
RevisionA:
Inprocess
J-STD-005
代替IPC-SF-819
RequirementsforSolderingPastes(焊膏技术要求)
1/95(orig.pub.)
Amendment1-1/95
J-STD-006
RequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSoldersforElectronicSolderingApplications
(电子级固态焊料技术要求)
1/95(orig.pub.)
Amendment1-6/96
RevisionA:
Inprocess
J-STD-012
ImplementationofFlipChipandChipScaleTechnology
(FC和CSP器件的安装)
1/96(orig.pub.)
J-STD-013
ImplementationofBallGridArrayandOtherHighDensityTechnology(BGA和HDI器件的安装)
7/96(orig.pub.)
IPC-DRM-18
ComponentIdentificationDeskReferenceManual
(元器件封装辨认手册)
9/95(orig.pub.)
RevisionA:
4/96
RevisionB:
2/97
RevisionC:
7/98
J-STD-020
Moisture/ReflowSensitivityClassificationofPlasticSurfaceMountDevices(塑封表面器件对潮湿和再流焊的敏感度要求)
October1996(orig.pub.)
RevisionA:
3/99
IPC-DRM-40
Through-HoleSolderJointEvaluationDeskReferenceManual
(通孔引线焊点评估参考手册)
IPC-DRM-SMT
SurfaceMountSolderJointEvaluationDeskReferenceManual
(表面组装焊点评估参考手册)
8/98
IPC-T-50
TermsandDefinitionsInterconnectingandPackagingElectronicCircuits(电子电路互连及封装术语和定义)
8/75(orig.pub.)
A-8/76
B-6/80
C-3/85
D-11/88
E-7/92
F-6/96
IPC-SC-60
PostSolderSolventCleaningHandbook(焊后溶剂清洗手册)
4/87(orig.pub.)
RevisionA:
Inprocess
IPC-SA-61
Post-SolderSemi-AqueousCleaningHandbook
(焊后半水清洗手册)
7/95(orig.pub.)
IPC-AC-62
PostSolderAqueousCleaningHandbook(焊后水清洗手册)
12/86(orig.pub.)
IPC-CH-65
GuidelinesforCleaningofPrintedBoardsandAssemblies
(印制板及其组件清洗导则)
(5)公众意见采纳与不采纳的合理性;12/90(orig.pub.)
RevisionA:
Inprocess
IPC-CS-70
GuidelinesforChemicalHandlingSafetyinPrintedBoardManufacturing(印制板制造化学处理安全准则)
(二)安全评价的基本原则8/88(orig.pub.)
价值=支付意愿=市场价格×消费量+消费者剩余IPC-MP-83
IPCPolicyonMetrication(IPC公制化导则)
安全评价是落实“安全第一,预防为主,综合治理”方针的重要技术保障,是安全生产监督管理的重要手段。
8/85(orig.pub.)
(1)规划实施后实际产生的环境影响与环境影响评价文件预测可能产生的环境影响之间的比较分析和评估;IPC-PC-90
GeneralRequirementsforImplementationofStatisticalProcessControl(实施SPC的总技术规范)
3.完整性原则;10/90(orig.pub.)
IPC-QS-95
(4)跟踪评价的结论。
GeneralRequirementsforImplementationofISO9000QualitySystems(实施ISO9000质量体系的总技术规范)
四、安全预评价4/93(orig.pub.)
建设项目所处环境的敏感性质和敏感程度是确定建设项目环境影响评价类别的重要依据,环境影响评价文件应当就该项目对环境的影响做重点分析。
IPC-L-125
SpecificationsforPlasticSubstratesCladorUncladforHighSpeed/HighFrequencyInterconnections
(高速/高频塑性基板特性规范)
一、环境影响评价的发展与管理体系、相关法律法规体系和技术导则的应用8/83(orig.pub.)
A7/92
IPC-EG-140
SpecificationforFinishedFabricWovenfrom"E"GlassforPrintedBoards("E"纤维织物印制板特性规范)
3/88(orig.pub.)
A6/97*
IPC-SG-141
SpecificationforFinishedFabricWovenfrom"S"GlassforPrintedBoards("S"纤维织物印制板特性规范)
2/92(orig.pub.)
IPC-A-142
SpecificationforFinishedFabricWovenfromAramidforPrintedBoards(Aramid纤维织物印制板特性规范)
6/90(orig.pub.)
IPC-QF-143
GeneralSpecificationforFinishedFabricWovenfromQuartz(PureFusedSilica)forPrintedBoards
(石英纤维织物印制板特性规范)
2/92(orig.pub.)
IPC-CF-148
ResinCoatedMetalforPrintedBoards(印制板涂树脂金属箔)
6/90(orig.pub.)
A9/98
IPC-MF-150
MetalFoilforPrintedWiringApplications
(印制线路金属箔)
8/66(orig.pub.)
A9/67
B2/71
C8/74
D3/76
E5/81
F10/91,8/92
G5/99
IPC-CF-152
CompositeMetallicMaterialSpecificationforPrintedWiringBoards(印制板复合金属材料特性规范)
6/90(orig.pub.)
A1/94
B3/98
IPC-FC-231
FlexibleBaseDielectricsforUseinFlexiblePrintedWiring
(柔性印制线路的绝缘基材)
orig.pub.7/74
A5/83
B2/86
C4/92
Amendment10/95
IPC-FC-241
FlexibleMetal-CladDielectricsforUseinFabricationofFlexiblePrintedWiring(柔性印制电路镶嵌金属夹层的绝缘基材)
7/74(orig.pub.)
A5/83
B2/86
C4/92
Amendment10/95
IPC-FA-251
GuidelinesforSingleandDoubleSidedFlexCircuits
(单、双面柔性电路指南)
2/92(orig.pub.)
IPC-D-279
DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies
(可靠的印制板SMT设计指南)
7/96(orig.pub.)
IPC-D-300
PrintedBoardDimensionsandTolerances
(印制板的尺寸和容差)
8/60(orig.pub.)
A7/61
B1/64
C10/65
D1/70
E10/70
F11/74Editorialrevision
G1/84
IPC-D-310
GuidelinesforPhototoolGenerationandMeasurementTechniques(照相底板生成和测量技术指南)
9/69(orig.pub.)
A12/77
B12/85
C06/91
IPC-A-311
ProcessControlGuidelinesforPhototoolGenerationandUse
(照相底板生成和使用过程的控制指南)
3/96(orig.pub.)
IPC-D-316
DesignGuideforMicrowaveCircuitBoardsUtilizingSoftSubstrates(软质基材的微波电路设计指南)
5/95(orig.pub.)
IPC-D-317
DesignGuidelinesforElectronicPackagingUtilizingHigh-SpeedTechniques(电子封装用于高速技术的设计指南)
4/90(orig.pub)
A1/95
IPC-D-322
GuidelinesforSelectingPrintedWiringBoardSizesUsingStandardPanelSizes(拼板中印制板迭用尺寸指南)
8/84orig.pub.
Reaffirmed9/91
IPC-MC-324
PerformanceSpecificationsforMetalCoreBoards
(金属芯电路板性能规范)
10/88(orig.pub.)
IPC-D-325
DocumentationRequirementsforPrintedBoards,AssembliesandSupportDrawings(印制板、组件和支撑件图纸文件要求)
1/87(orig.pub.)
A5/95
IPC-D-326
InformationRequirementsforManufacturingPrintedBoardAssemblies(印制板组装制造的文件资料要求)
4/91(orig.pub.)
IPC-D-330
DesignGuideManual(设计指导手册)
IPC-NC-349
ComputerNumericalControlFormattingforDrillersandRouters
(钻孔和布线器的计算机控制数据格式)
8/85(orig.pub.)
IPC-D-350
PrintedBoardDescriptioninDigitalForm
(印制板的数字化表述)
8/72(orig.pub.)
A2/75
B8/77
C10/85Reaffirmed
D
7/92TechnicalContentIdenticaltoIEC-1182-1
IPC-D-351
PrintedBoardDrawingsinDigitalForm
(印制板图形的数字化表述)
8/85(orig.pub.)
IPC-D-352
ElectronicDesignDataDescriptionforPrintedBoardsinDigitalForm(印制板电子设计数椐的数字化表述)
8/85(orig.pub.)
IPC-D-354
LibraryFormatDescriptionforPrintedBoardsinDigitalForm
(印制板文件格式的数字化表述)
2/87(orig.pub.)
IPC-D-355
PrintedBoardAssemblyDescriptioninDigitalForm
(印制板组件的数字化表述)
1/95(orig.pub.)
IPC-D-356
BareBoardElectricalTestInformationinDigitalForm
(印制裸板电测信息的数字化表述)
3/92(orig.pub.)
A1/98
IPC-MB-380
GuidelinesforMoldedInterconnectionDevices
(模制器件互连指南)
10/90(orig.pub.)
IPC-D-390
AutomatedDesignGuidelines(自动设计指南)
7/74(orig.pub.)
A2/88
IPC-C-406
DesignandApplicationGuidelinesforSurfaceMountConnectors(表面组装连接器设计和应用指南)
1/90(orig.pub.)
IPC-CI-408
DesignandApplicationGuidelinesfortheUseofSolderlessSurfaceMountConnectors
(非焊接表面组装连接器设计和应用指南)
1/94orig.pub.
IPC-BP-421
GeneralSpecificationforRigidPrintedBoardBackplaneswithPress-FitContacts
(带压接连接器的刚性印制背板通用技术规范)
10/80(orig.pub.)
Reaffirmed4/90
IPC-D-422
DesignGuideforPressFitRigidPrintedBoardBackplanes
(刚性压接印制背板设计指南)
9/82(orig.pub.)
IPC-DW-424
GeneralSpecificationforEncapsulatedDiscreteWireInterconnectionBoards
(印制板分立包皮导线互连通用技术规范)
1/95(orig.pub.)
IPC-DW-425
DesignandEndProductRequirementsforDiscreteWiringBoards(分立线路板设计和成品技术规范)
9/82(orig.pub.)
A5/90
IPC-DW-426
SpecificationsforAssemblyofDiscreteWiring
(分立线路组装技术规范)
12/87(orig.pub.)
IPC-TR-460
Trouble-ShootingChecklistforWaveSolderingPrintedWiringBoards(印制板波峰焊故障检查表)
1973(orig.pub)
A2/84
IPC-TR-461
SolderabilityEvaluationofThickandThinFusedCoatings
(厚、薄热涂层的可焊性评估)
3/79(orig.pub.)
IPC-TR-462
SolderabilityEvaluationofPrintedBoardswithProtectiveCoatingsOverLongTermStorage
(具有持效保护涂层的印制板可焊性评估)
10/87(orig.pub.)
IPC-TR-464
AcceleratedAgingforSolderabilityEvaluations
(可焊性的加速老化评估)
orig.pub.4/84
A12/87
IPC-TR-465-1
RoundRobinTestonSteamAgerTemperatureControlStability
(恒温蒸汽老化的联合测试报告)
1993
IPC-TR-465-2
TheEffectofSteamAgingTimeandTemperatureonSolderabilityTestResults
(蒸汔老化时间和温度对可焊性测试结果的影响)
1993
IPC-TR-465-3
EvaluationofSteamAgingonAlternativeFinishes,PhaseIIA
(对不同处理剂的蒸汽老化评估,PhaseIIA)
7/96
IPC-TR-466
WettingBalanceStandardWeightComparisonTest
(润湿平衡标准称重比较测试)
4/95(orig.pub.)
IPC-TR-467
SupportingDataandNumericalExamplesforANSI/J-STD-001AppendixD(ANSI/J-STD-001附件D的支持数据和数字举例)
10/96(orig.pub.)
IPC-TR-468
FactorsAffectingInsulationResistancePerformanceofPrintedBoards(印制板绝缘电阻的影响因素)
3/79(orig.pub.)
IPC-TR-470
ThermalCharacteristicsofMultilayerInterconnectionBoards
(多层互连板的热特性)
1/74(orig.pub.)
IPC-TR-474
AnOverviewofDiscreteWiringTechniques(分立线路综观)
3/79(orig.pub.)
Reprint1984
IPC-TR-476
HowtoAvoidMetallicGrowthProblemsonElectronicHardware(如何避免电子硬件的合金化生长)
9/77(orig.pub.)
A6/84
IPC-TR-481
ResultsofMultilayerTestProgramRoundRobinV
(多层V循环测试程序的结果)
4/81(orig.pub.)
IPC-TR-483
DimensionalStabilityTestingofThinLaminates-ReportonPhaseIInternationalRoundRobinTestProgram
(薄层压板尺寸稳定性测试----)
4/84(orig.pub.)
10/87Addendums
Revised3/91
IPC-TR-484
ResultsofIPCCooperFoilDuctilityRoundRobinStudy
(IPCCooper箔延展性研究联合报告)
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