SMT英语Word文档格式.docx
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SMT英语Word文档格式.docx
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somesolderalloys.
AirKnife
Unitblowingairtowardsanobjectinathinstraightline.
E.g.usedinwavesolderingmachinestoremoveexcessfluxfrom
thePCB.
Algorithm
Aspecificationofactionssolvingatask.
Alloy
Amaterialmadebymeltingtwoormoremetalstogether.
Alumina
Whitesubstratematerialusedprimarilyinthickfilmapplications.
Antimony
Sb.Semi-metallicwithatomicNo.51.Usedinsomesolderalloys.
AntistaticMaterial
Partlyconductivematerialresistingrapidstaticcharging.
AOI
ShortforAutomaticOpticalInspection.UnitinspectingsolderpasteprintorsolderedPCB'
Aperture
Openinginametalstencilormeshscreen.
Aperturefile(s)
Computerfile(s)containingX,Ycoordinates,shapeandaperturesizesusedinthestencilmanufacturingprocess.
AQL
ShortforAcceptableQualityLevel.Themaximumallowablenumberofdefectsper100units.
Aqueous
Watersoluble.
ArchimedesPump
Oraugerpump.DispensingunitusinganaugertoforcetheadhesiveontothePCB.
AspectRatio
StencilthicknesstothewidthofthesmallestapertureorPCBthicknesstothediameterofthesmallesthole.
Au
Chemicalsymbolforgold.MetalwithatomicNo.79.UsedasprotectivelayeronPCBsolderpads,keyboardsetc.
AugerPump
OrArchimedespump.DispensingunitusinganaugertoforcetheadhesiveontothePCB.
AutomaticOpticalInspection
AOI.UnitinspectingsolderpasteprintorsolderedPCB'
s.
B
BallGridArray
BGA.ICpackagewithsolderspheresinanarrayonbottomsideofcomponentbasesubstrate.
BallPitch
ReferstothedistancebetweenthecentresoftwoballsonanBGApackage.
BareBoard
PCBthatarenotmountedwithcomponents.
BareDie
AnunpackagedIC(Die).
Bi
Chemicalsymbolforbismuth.MetalwithatomicNo.83.Usedinsomesolderalloys.
BillofMaterials
BoM.ListofcomponentsforaPCBA.Containingreferenceno.andpartno.etc.
Bismuth
Bi.MetalwithatomicNo.83.Usedinsomesolderalloys.
BGA
ShortforBallGridArray.ICpackagewithsolderspheresinanarrayonbottomsideofcomponentbasesubstrate.
BoardHandlingUnit
UnitconveyringPCBsfromonemachinetoanotherorturningorflippingthePCB.
BoM
ShortforBillofMaterials.ListofcomponentsforaPCBA.Containingreferenceno.andpartno.etc.
BondingMaterialsjoinedtogether.
BQFP
ShortforBumperedQuadFlatPackage.ICpackageswithleadsonfoursidesandcornerbumpers.
BulkComponents
Loosecomponents.Componentsdeliveredinspecialbulkcontainerscanbesuppliedtotheplacement
machineusingabulkfeeder.
BulkFeeder
Unitusedtofeedcomponentsfrombulkcontainersintotheplacementmachine.
BumperedQuadFlatPackage
BQFP.ICpackageswithleadsonfoursidesandcornerbumpers.
C
CAD
ShortforComputerAidedDesign.Computersystemusedtodesignaproduct.
CAM
ShortforComputerAidedManufacturing.Computersystemusedtomanufactureaproduct.
CBGA
ShortforCeramicBallGridArray.AsBallGridArraywithaceramicbasesubstrate.
CeramicBallGridArray
CBGA.AsBallGridArraywithaceramicbasesubstrate.
ChemicalTin
OrImmersionTin.UsedasprotectiononPCBsolderpads.
Chip
Slangexpressionforaverysmallcomponentoranintegratedcircuit.
ChipOnBoard
COB.AnunpackedsilicondieplaceddirectlyonthePCBandwirebonded.
Chips
Slangexpressionforverysmallcomponentslikeresistorsandcapacitors.
ChipShooter
FastSMDplacementmachineprimarilyplacingsmallchips.
Chip-ScalePackage
CSP.Verysmallpackagetype.TheICchipisattachedtoacarrierandconnectedto
the
ballsonthecomponent
bottomsideusingvia'
sandwirebonding.
CIM
ShortforComputerIntegratedManufacturing.
COB
ShortforChipOnBoard
CoefficientofThermalExpansion
CTE.Theratioofchangeindimensionperunitchangeintemperature.
Component
Part.Anelementofacompletefunctionalunit.
ComponentCamera
AcameraintheSMDplacementmachineusedtorecognizeandmeasurethepositionandangleofthe
pickedupcomponents.ThevisionsystemthencalculatethenecessarycorrectionsforanaccurateplacementonthePCB.
ComputerIntegratedManufacturing
CIM.
ComputerAidedDesign
CAD.Computersystemusedtodesignaproduct.
ComputerAidedManufacturing
CAM.Computersystemusedtomanufactureaproduct.
Conductor
Electricalconnection.E.g.PrintedwiringonaPCB.
ConductorThickness
ThethicknessofaPCBconductortrack.
ConductorWidth
WidthofaPCBconductortrack.
ControlledConvection
Convectionheattransferredweretemperature,flow,rateandvelocityareaccuratelycontrolled.
Convection
Heattransferoccurringduetotemperaturedifference.
CoolDown
Referstothesolderprofileperiod,afterreachingthepeaktemperature,wherethesolderalloycoolsbelowthepoint
wherethealloysolidifyagain.
Coplanarity
Theverticalvariationoftheleadpositionsonapackage.
Copper
Cu.MetalwithatomicNo.29.UsedmainlyonPCB'
saselectricalconnectionsformingthecircuitbetweenthecomponents.
CSP
Chip-ScalePackage.Verysmallpackagetype.TheICchipisattachedtoacarrierandconnectedto
CTE
ShortforCoefficientofThermalExpansion.Theratioofchangeindimensionperunitchangeintemperature.
Cu
ChemicalsymbolforCopper.MetalwithatomicNo.29.UsedmainlyonPCBsaselectricalconnectionsformingthecircuit
betweenthecomponents.
CycleTime
Thetimeittakestoperformacompletecycleontheprocessinquestion.
D
DiscreteComponent
Definedasseparatecomponentsineachpackage.
Delamination(PCB)
AseparationofthedifferentbondedlayerswithinthePCB.
DeltaT
ΔT.Temperaturedifferential.
Desoldering
Removalofthesolderalloyfromajoint.
Dewetting
Themoltensolderrepelsonthesolderpadorcomponentlead.Effectofpoorsolder-ability.
DoubleLayerPCB
Doublelayerprintedcircuitboard.Laminatewithtwolayersofconductorsformingacircuitpattern.
DoubleLayerPrintedCircuitBoard
DoublelayerPCB.Laminatewithtwolayersofconductorsformingacircuitpattern.
DoubleSidedReflow
Soldering
AtechniquewereSMC'
sareplacedinsolderpasteandreflowsolderedfirstlyononesideofthe
PCBandsecondlyrepeatedontheotherside.Gravitylimitsthetypeofpackagesthatcanbeusedonthefirstmountedside.
Dross
Oxidizedsolderalloyandcontamination
layingontopofthemoltensolderinawavesolderingmachine.
Dry-Pack
BagsspeciallydesignedtoMSDstorage.
DryRun
AnexpressionforaSMDplacementmachinerunningbut
withoutactuallyplacingcomponents.
DummyComponent
Non-functionalcomponent.
E
EdgeConveyor
Devicetransportingand
supportingtheproduct(PCB)ontheedge.
ElectronicsManufacturingServices
EMS.
ElectrostaticDischarge
ESD.Thetransferofanelectricalchargebetweentwoobjectswithdifferentelectrostaticpotential.
CertainIC'
s
areverysensitivetoESD.
EMS
ShortforElectronicsManufacturingServices.
ESD
ShortforElectroStaticDischarge.
Thetransferofanelectricalchargebetweentwoobjectswithdifferentelectrostaticpotential.
CertainIC'
sareverysensitivetoESD.
EtchedStencil
Thinplateofsteelorbrasswithetchedholes.Usedinsolderpasteprinting.
Etching
Achemicalprocessthatremovesselectedmaterialthatarenotcoveredbyaprotectiveresist.
EutecticSolderAlloy
Analloythatchangedirectlyfromsolidtoliquidstateataexacttemperature.Theeutecticalloyalsohavea
lowermeltingpointthanofitsdifferentmetalcomponents.
F
FC
ShortforFlip-Chip.ReferstobaresiliconIC'
sflippedandattacheddirectlyontothePCB.
FiducialCamera
CamerausedtomeasurethePCBpositionrelativetotheplacementhead.
FiducialMark
AsmallmarkonthePCBusedtocalculatethePCBpositionrelativetotheplacementhead.Thecalculationsarethen
usedtoensurepreciseplacementofthecomponents.
Fillet
Asolderfilletisthebuildupofsolderbetweenthesolderlandandthecomponentterminal.
FinePitch
ReferstoashortdistancebetweenthecentresoftwoleadsonanIC.0.5mm(20mil)anddown.
FinePitchBallGridArray
FPBGA.SeeBallGridArray.
FinePitchPlacerAveryaccurateSMDplacementmachinecapableofplacingfinepitchcomponents.
FinePitchQuadFlatPackageFPQFPorFQFP.ReferstoaspecificgroupoffinepitchICpackageswithleadsonallfoursides.
FinePitchTechnologyFPT.Technologyinvolvingcomponentswithveryshortdistancebetweenthecentresoftwoleads.
From0.5mm(20mil)anddown.
FirstPassYieldYield.Finishedunits(inpercent)notrequiringrework.
FlexPCBFlexible(bendable)printedcircuitboard.Basematerialsar
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