人力资源CSRCM017封装考核评估资料精编版.docx
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人力资源CSRCM017封装考核评估资料精编版.docx
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人力资源CSRCM017封装考核评估资料精编版
发行日期
IssuingDate
版本号
Revision
修改事项
Proceeding
A
首版发行Firstversionissue
1、Purpose目的
ThisdocumentprovidestemplatesforrecordingpackagequalificationdataforRFMDproductandinstructionsforcomplyingwithMaterialsDeclaration.
提供记录RFMD产品考核认证所需信息资料的模板,及遵从物质申明的说明
2、Scope范围
ApplytoRFMDpackagequalification
适用于RFMD考核认证产品
3、Instruction说明
3.1MaterialsDeclaration:
TheSubcontractorAssemblyhouseisrequiredtosubmitMaterialsDeclarationformslistingtherequiredbanned,bannedwithacceptablethresholdlevel,reportableorothermaterialsrequiredbyRFMDQAL-21-1028forassembliesmanufacturedforRFMD.Thesearerequiredforcurrentandnewassembliesandmustbeupdatedwhenevermaterialchangesoccurorwheneveranewsubstrateprocessdevelopmentorassemblyqualificationbegins.Thesupplierwillberequiredtoprovideproofofcompliancywithachemicalanalysis.SeeQAL-21-1028fordetailsonrequirements,reportingstructure,andreportingformat.
物质申明:
外包封装厂需要提交物质声明书,列明禁用材料,禁用但可接受门限的材料、需告知的或其他由RFMDQAL-21-1028文件规定的用于RFMD封装制造产品的材料.这些规定适用于现有及未来新的封装产品,当材料变更,新基板工艺流程的开发或开始封装考核认证时都要提交该声明书.供应商还需要提供化学分析作为依据.参考QAL-21-1028文件中的详细要求,报告的结构和格式。
3.2Addlines,inserttables,embedobjectsateachapplicableprocesssteptocapturepertinentprocessdata.
各工序可根据需收集的相关信息资料增加表格的行数,插入新的表格和对象
3.3Compresspicturesonceallapplicableprocessinformationhasbeeninserted.Gotoviewtoolbars,selectpictures.Gotopicturestoolbarandcompresspictures,OK.
完成相应的所有工序的信息资料后压缩图片.在视图工具栏中选择图片后压缩或在图片工具栏栏中压缩图片
4、Reference参考
CSR-CM012(PKG-21-1013)SubcontractorAssemblySpecificationforModules
CSR-CM029(QAL-21-1028)BannedSubstancesListandRFMDGreenDefinition
5、QualificationData考核评估资料
拟制:
审核:
批准:
QualificationData
PartNumberQualLotNumberTraceCode
PackageType
PackageSizeThickness
WaferSizeThickness(listalldie)
LeadCount
PONumber
MSLTargetLevel
AssemblyLocation
BondingDiagramPartNumber
BOMPartNumber
BrandingDiagramPartNumber
PreparedBy
ExecutiveSummary
YieldSummary
Lot#1Lot#2Lot#3TotalYield
SMTYield
Lot#1Lot#2Lot#3TotalYield
AssyYield
Lot#1Lot#2Lot#3TotalYield
FinalYield
DataSummaryAllLotscombined
Process
Test
Criteria
±
SS
Max
Min
Avg
Std
Cpk
SMT
PasteThickness
SMT
ComponentShear(gramforcepereachSMDsize)
SMT
FluxThickness
DieAttach
PlacementX
DieAttach
PlacementY
DieAttach
Shear(eachdie)
DieAttach
Rotation
FlipChipAttach
Shear(eachdiesize)
FlipChipAttach
Placement
FlipChipAttach
Standoff
WireBond
PullsDietoSub
WireBond
PullsDietoDie
WireBond
PullsSubtoSub
WireBond
PullsRSSB
WireBond
LoopHeight
WireBond
Span
WireBond
PlacementX
WireBond
PlacementY
WireBond
BallShear>71umBPO
WireBond
BallShear>60<=71umBPO
WireBond
BallShear>52<=60umBPO
WireBond
SSBShear>71umBPO
WireBond
SSBShear>60<=71umBPO
WireBond
SSBShear>52<=60umBPO
WireBond
Ballshearonsubstrate
Plating
Thickness
Plating
Composition
Ballattach
BallShear
Ballattach
BallHeight
SolderBump
BumpDiameter
SolderBump
BumpComposition
SolderBump
BumpHeight
SolderBump
BumpShear
SolderBump
BumpCo-planarityonwafer
SolderBump
BumpCo-planarityonDie
Singulation
SizeX
Singulation
SizeY
Singulation
SizeZ
Singulation
RegistrationX
Singulation
RegistrationY
Singulation
Coplanarity
Trim/Form
TiptoTip
Trim/Form
Standoff
智慧树思辨与创新考试答案Trim/Form
Coplanarity
教学质量综合测评
整百,整千加减法教学反思
教案的教学反思怎么写
数学教师读书笔记
教学工作情况
新军事变革全面发展始于。
ConclusionsandRecommendations
杨浦区高三英语一模答案2018
BOM
新初一语文QualLot#1(repeatforquallot2and3)
描写学校的成语BuildDateTracecodeWaferLotNumbers
SolderBumpManf(ifapplicable)PartNumberLotNumberAlloy
SubstrateorLeadframeManfPartNumberLotNumberMaterialSetorAlloy
FlipChipFluxManfPartNumberLotNumber
SolderPasteManfPartNumberLotNumberAlloy
DieAttachManfPartNumberLotNumber
WireManfPartNumberLotNumber
LidManfPartNumberLotNumber
ShieldEpoxyManfPartNumberLotNumber
ShieldManfPartNumberLotNumberAlloy
MoldCompManfPartNumberLotNumberTabletSize
SolderBallManfPartNumberLotNumberAlloy
ManufactureDieDescriptionPadOpeningPadPitchDieSizeDieThickness
D1
D2
D3
D4
D5
ManufactureFlipChipDieDescriptionPadOpeningBumpPitchDieSizeDieThickness
D1
D2
D3
D4
D5
PassiveComponents(Useifapplicable)
ManufactureDescriptionValueType
Capacitor
Resistor
Inductor
Backgrind(UseifApplicable)
EquipmentMakeandModelnumber
BladeType
FeedRate
SpindleSpeed
WaterType
WaterResistivity
WaferSaw(UseifApplicable)
EquipmentMakeandModelnumber
BladeType
FeedRate
SpindleSpeed
WaterType
WaterResistivity
SMT(UseifApplicable)
SMTLineNumberorindividualequipmentnumbers
ProvideReflowProfileGraphofQuallot(repeatforqualificationlot2and3).Profiletobeobtainedprelotforallquallots.
Providedata:
TimeaboveLiquidous
PeakTemperature
Timeto150°C
Timeabove150°C
Reflowprofilename
NitrogenovenO2ppm
ZoneSettings
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
Z9
Z10
Z11
Z12
Top
BTM
FluxPrinting(forFlipChip–useifapplicable)
Attachsamplepictureforeachdie.
FluxStencilParameters:
StencilThickness
StencilMaterial
ApertureOpeningDesign–(Specialdesignand%ofsoldermaskormetalopening)
FluxPrintProcessParameters:
Bladetype(plastic&hardness/metal)andAngle
BladeForce
BladeSpeed
Separationspeed&distance
SolderStencilParameters:
StencilThickness
StencilMaterial
ApertureOpeningDesign–(Specialdesignand%ofsoldermaskormetalopening)
ForFlipChip–RecessZdepth&openingX,Ydistance(s)
PastePrintProcessParameters:
Bladetype(plastic&hardness/metal)andAngle
BladeForce
BladeSpeed
Separationspeed&distance
Providesamplepictureofsolderpasteprint.
FluxThickness(ifapplicable),(repeatforlots2and3)
12345678910MinMaxAvg
ST1
PasteThickness,(repeatforlots2and3)
12345678910MinMaxAvg
ST1
0402ComponentSheargramforce,(repeatforlots2and3)
12345
Inductors
Capacitors
Resistors
MinMaxAvg
0201ComponentSheargramforce,(repeatforlots2and3)
12345
Inductors
Capacitors
Resistors
MinMaxAvg
01005ComponentSheargramforce,(repeatforlots2and3)
12345
Inductors
Capacitors
Resistors
MinMaxAvg
Addrowsorcolumnsforanyothersize/shapesurfacemountcomponentnotlisted.Performsamequantityofshearsandlisteddatagatheringrequirements.
FlangePackages(ifapplicable)
PreFlangeFlatnessMeasurement–Datapertenflanges
Measurefivelocationsperflange,centerandfourcorners.
FlangeFlatness,(repeatforlot2and3)
12345MinMaxAvg
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
DieAttach
EquipmentMakeandModelnumber
AttachMethod
Parameters
DiePlacement,(repeatforlot2and3)
12345678910MinMaxAvg
D1x
D1y
D2x
D2y
D3x
D3y
D4x
D4y
D5x
D5y
DieShear,(repeatforlot2and3)
12345678910MinMaxAvg
D1
D2
D3
D4
D5
DieRotationinDegrees,(repeatforlot2and3)
12345678910MinMaxAvg
D1
D2
D3
D4
D5
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