微电子专业专业英语翻译.docx
- 文档编号:8557903
- 上传时间:2023-01-31
- 格式:DOCX
- 页数:13
- 大小:663.94KB
微电子专业专业英语翻译.docx
《微电子专业专业英语翻译.docx》由会员分享,可在线阅读,更多相关《微电子专业专业英语翻译.docx(13页珍藏版)》请在冰豆网上搜索。
微电子专业专业英语翻译
PracticalApplicationsofSemiconductorReliabilityModelingLoriE.Bechtold,BoeingCommercialAirplanes
FlorianMolière,PhD,AirbusGroupInnovations
DavidA.Sunderland,PhD,BoeingSpace&IntelligenceSystems
BahigTawfellos,HoneywellAerospace
KeyWords:
Physics-of-Failure,Predictions,SemiconductorReliability
SUMMARY&COCLUSIOS
Apracticalmethodologyformodelingthereliabilityofdeepsubmicron(<90nm)semiconductormicrocircuitsprovidestimelyandneededinformationfortheintegrationofcommercialofftheshelf(COTS)electronicsinairborneandhighreliabilityapplications.
(1)Designingandassuringcustomerconfidenceinairbornehighreliabilityapplicationsbecomesmorechallengingaselectronicstechnologiesdeveloprapidlyandcommercialapplicationdemandsdrivetheincreasinguseoffaster,moreintegrated,higherdensitycommercialofftheshelf(COTS)electronics.
(2)UseofCOTSelectronicsprovidesadvantagesofgreatercomputationalpower,withhighermanufacturingvolumesdrivingbetterqualitycontrol.COTSalsointroducethenewproblemoflife-limitedsemiconductors[1].Outdatedadequatelysupportreliableaerospacesystemdesign[2].
TheSemiconductorReliabilityproject,thatlaunchedinApril2013bytheAerospaceVehicleSystemsInstitute(AVSI)undertheAuthorityforExpenditure(AFE)83,(3)developedapracticalapproachtomodelingtherandomandwearoutfailuremechanismsofdeepsub-micron(<90nm)microcircuits.Unlikepriorphysicsoffailureapproaches,themethodologywaskeptsimpleandwasimplementedinaspreadsheet.(4)ThisspreadsheetisprovidedfreeofchargetoR&Mpractitionerstohelppromoteunderstandingandcommonusageofthemethodology.(5)RecipientsofthespreadsheetareexpectedtoprovidefeedbacktotheAVSIteaminreturn.Theprojectalsoencouragesmicrocircuitdevicesupplierstoprovidereliabilityinformationinsomeform,(6)eitherbyusingthespreadsheetordirectlyprovidingthecumulativedefectfraction(CDF)oftheirproductintheapplicationenvironments.
Whenmicrocircuitdevicesuppliersprovidetestdataresultsfortheirproducts,thespreadsheetisusedtoscaletheresultsfromtesttousageenvironments.(7)ThemethodologydevelopedbyAVSIdiffersfromtraditionalArrheniusmethodsinthatscalingisnotonlybasedontemperaturebutalsoonvoltage,currentandfrequency.(8)Modelsoftimedependentdielectricbreakdown(TDDB),hotcarrierinjection(HCI),negativebiastemperatureinstability(NBTI)andelectromigration(EM)areusedtogainanaccuratereliabilityassessmentfortechnologiessensitivetothesemechanisms.
(9)ThispaperdescribestheAVSIreliabilityresearchproject,thesemiconductormicrocircuitreliabilitymodels,andcommercialandprovidesexamplesoftheapplicationofthesemodelstosupportreliableavionicssystemsdesign.
ITRODUCTIO
(10)COTSmicrocircuitwearouthasbecomeamajorconcernforbothmilitary/aerospace(mil/aero)integratorsandavionicsequipmentmanufacturercompanies(OEMs).(11)Bycontrastwithpackagingreliabilityissues,microcircuitwearoutelectronicsdegradationscannotbeeasilyaddressedandrevealedbymeansofthetypicalqualificationtestsperformedonequipment.(12)Thisisbecauseequipmentqualificationtestsmainlyaccelerateenvironmentaltresses(thermalcyclevibration,moisture)withoutthenecessaryfunctionalconstraintsrequiredtobringtolightthelifelimitedsemiconductorissues.Inthissense,wearoutconcernshavetobeaddressedinanearlydesignphaseatthesub-assemblylevel(Figure1)throughcomponentselectionmethodologiesliketheoneproposedinthispaper.
(13)Designingforhighreliabilityapplicationsisachallengethatrequiresmulti-levelcollaborationtoassureverticalintegrationoftherequirementsandinformationflownecessaryfordesign.(14)Figure2illustratestheflowofinformationbetweenmembersofthesupplychain,showinggenerallythedownwardflowofrequirementsandupwardflowofanalysisandtestdataneededtodesignsystemstomeettherequirements.
(15)Mil/aerointegratorsdesignaircraftandotherplatformsforcommercialandmilitaryapplications.(16)AllcompaniesinthismarketsegmentfacethecommonneedtousethebestavailableCOTSelectronicsinhighreliabilityapplications.(17)Airbornehighreliabilitymil/aeroapplicationsgenerallyexperiencegreaterenvironmentalstressesthangroundbasedcommercialapplications.(18)Theydrivereliabilityrequirementsinthecontextofthermalprofiles,thermalcyclingandvibrationenvironmentsdowntotheirsuppliers,theavionicsOEMs.(19)AvionicsOEMsmustfindarchitecturesolutionsandtrademultipleandoftenconflictingrequirements.
TheavionicsOEMsprocureelectronicsdevicesfromthemicrocircuitdevicesuppliersandmustunderstandhowthedevicewilloperateintherequiredenvironments.(20)MitigationmeasuresattheavionicsOEMlevelincludeadequatelyderatingthedeviceinthecontextofthermalprofiles,thermalcycling,vibration,voltageandfrequency,andassuringadequatearchitectureredundancytoguaranteereliabilityandsafetyrequirementsaremetthroughouttheunitlife.
ThemicrocircuitdevicesuppliersmustprovideavionicsOEMswithenoughinformationandsubstantiatingdatasotheOEMcanmakegooddesigndecisionswhileusingtheirdevicesinelectronicsmodules.TheavionicsOEMmustprovidethemil/aerointegratorswithenoughinformationandsubstantiatingdataforthemtousethemodulesinanairborneplatformthatmeetstheircustomerrequirementsforhighfunctionality,safetyandreliabilityovertheoperationallifetimesoftheequipment.
(21)TheAFE83projectaimstobreakdowncommunicationbarriersbetweenthesemarketsegmentstoimprovepracticalsemiconductorreliabilityassessments.(22)AFE83isworkingincollaborationwith与...合作microcircuitdevicesupplierstodevelopapracticablemethodologyforpredictingthereliabilityofintegratedcircuitsemiconductorsforhighreliabilityapplications.Itisdevelopingasimplereliabilitypredictionmethodologyforrandomfailurerateandthetimetointrinsic.(23)TherandomfailurerateportionofthemodelissimilartoMIL-HDBK-217models[3],becauseitisscaledwithdevicecomplexity复杂性anduseconditions.(24)ThephysicsoffailuresemiconductorwearoutmodelsdevelopedinpriorAVSIprojects[4]areusedasastartingpointandwillbemodifiedbasedontheinputsfromsemiconductorsuppliers.
2AVSI
AVSIisaresearchcooperativethataddressesissuesimpactingtheaerospacecommunitythroughinternationalcollaborativeresearchconductedbyindustry,governmentandacademia.(25)(翻译)Memberscombinetheirresourcesandtalentstoorganizeandconductresearchprojectsdirectlybenefitingthememberorganizationsandoftenbenefitingtheaerospaceindustryasawhole.(26)AVSIprovidesavoicefortheirmembershiptojointlyinfluencestandards,processesandtechnologiesrelatedtoaerospaceindustry.
AVSIhasinvestedoveradecadeofresearchintoelectronicsreliability,includingdeepsub-micron(<130nm)semiconductorwearoutmechanisms,atmosphericradiationeffectsandtheintegrationofphysicsoffailuremethodsintoreliabilitypredictions.In2010,AVSIreliabilityroadmapproject,AFE74,engagedabroadcommunityofreliabilitysubjectmatterexpertstodevelopaconsensusbasedReliabilityPredictionTechnologyRoadmap.TheRoadmapidentifiedmanygapsinreliabilitypredictioncapabilitytosupporttheapplicationneedsidentifiedbythestakeholders.(27)Thestakeholdersrequireamethodologythatresultsintimely,accurateandnecessaryinformationtosupportdesignengineeringprocessesthatbuildcustomerconfidenceinproductreliability.Semiconductorreliabilitymodelingwasidentifiedasahighprioritybytheroadmapproject[5].
3APPLICATIOS
Aerospaceapplicationsoftenrequirea20-30yearservicelife,whileCOTSelectronicsusuallyaredesignedforshortermarketcycles.whileCOTSelectronicsusuallyaredesignedforhighperformanceandlowcost,consequentlylongtermreliabilityislessofaconcern.ThisleaveslessincentiveforCOTSsupplierstoaddresstheneedforextendedlifebyapplyingmitigationmeasuresforthesefailuremechanisms.If“designforreliability”measureshavebeenappliedwithinthemicrocircuit,thesemaybeproprietaryornotfullyunderstoodbytheuser,sowillnotfigureintheuser’sreliabilitymodeling.Byfocusingatthepartlevel,theAFE83spreadsheetallowsthesemitigationmeasurestobeincludedbythesupplier
Avionicssystemsaredesignedtorigoroushighstandardsofsafetyandreliability,withgrowingprocessingdemandsofadvancednavigation,guidanceandcommunicationsystems.HighfunctionaldensityandhighspeedprocessingtosupportthegrowingavionicssystemsrequirementsisenabledthroughtheuseofCOTSelectronicswithdeepsub-micron(<90nm)integratedcircuit(IC)technologies.Airborneenvironmentsaregenerallyharsherthangroundbasedapplications.Eachflightcycleinducesvibrationcombinedwithathermalcycleinmanyelectronics,especiallythoseinpartiallyprotectedareassuchastheelectronicsbay.
(28)Flightenvironmentsareharshonelectronicsandelectronicpackaging,duetoextremesoftemperature,frequentthermalcycling,moisture,vibration,pressure,andatmosphericradiation.(29)Inaviationapplications,reliabilityneedscanbehigherasapplicationconditionsbecomeworse.
TheeffectoftemperatureonreliabilitymaybeseeninFig.3.(30)Thischart,providedbyXilinx,isanexampleofonetypeofresultthatcouldcomeoutofthespreadsheet.HereXilinxhasusedaninternaltool,describedin[6],tocomputetimetoanacceptablepercentfailureforeachofthreedistinctint
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- 微电子 专业 英语翻译