Basic-Die-Bond-Process.ppt
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- 上传时间:2022-10-17
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Basic-Die-Bond-Process.ppt
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BasicDieBondProcess,TableofContent,IntroductionTypicalDieBondingSequenceDispensingDiePickingDieBonding,Introduction,BasicDieBondProcess:
Toattachthediestothepadsonthesubstrates,Introduction,CommonDieBondProcessesEpoxydiebondingEutecticdiebondingSoftsolderdiebonding,TypicalDieBondSequence,Step1:
Dispensing,Step2:
DiePicking,Step3:
DieBonding,Step1:
StackLoader,Substrate,CommonlyusedsubstratesPCBLeadframeBGACeramic,Wafer,Differenttypeofwaferring/frame/wafercassetteWafercassetteDiscoK&SWaferringDiscoK&STeflon,Dcompany,Kcompany,DifferenttypeofwafertapematerialMylartapeUVtapeWafflepack,BlueMylarTape,ColorlessUVTape,Wafer,FactorsdeterminethedegreeofuniformityofwafertapeDiesizeLargediesizehaveabettertackinessSurfacefinishofthewaferbackSmoothsurfaceofwaferbackhavehighertackinessDurationofdieadhesiontowafertapeThelongerthedieareonthetape,themoretheyadhere,Wafer,FactorsdeterminethedegreeofuniformityofwafertapeExposuretoUVlightThelongertheexposuretoUVlight,thelesstheyadhereStorageconditionItshouldbestoredinamoderateconditiontemp:
10-25Chumidity:
60-70%TapemountingprocessamountoftensionshouldbeeveninbothX&Ydirection,Wafer,Dispensing,Time-Pressure-VacuumVolumetricStamping(RotatingDisc),Tool:
-Epoxywriting-ShowerHead,Tool:
-StampingPin,Dispensing,Dispensing,BackgroundInformation-EpoxyFunctionofepoxyAdheresthedieonsubstrateCommonly-usedepoxyTypicalProperty,Time-Pressure-VacuumSystemAprocessoftheapplicationofcompressedairinapresetperiodforthefluiddispensingApplyVacuumforremovingthecompressedairMaintainthepressurePreventdripping&suckback,DispensingMethodTime-Pressure-Vacuum,Syringewithepoxy,Vacuum,Pressure,DrawBacksDispensingvolumeepoxyviscositySyringeInternalpressureepoxylevelAirvolumeinsidethesyringechangesfordifferentepoxylevelResponsetimefor“vacuum-suction”and“air-compression”isthuschangingwithepoxylevelIfthevacuumlevelisnotadjustedproperly,“epoxydripping”&“sucking-inofairbubbles”mayoccureasily.,DispensingMethodTime-Pressure-Vacuum,Time-Pressure-dispenser(fromMusashi)Musashidispensingsystemcancompensateepoxylevelchangeinsyringebyreal-timemonitoringontheactualpressureresponseNeedtopreparea“full”syringeandanempty”syringeinordertoteachthedispenserhowtocompensateTheTP-dispenserwillthenadjustthe“dispensingtime”&“vacuumlevel”accordinglytocompensateforanychangeinsyringeepoxylevelUsercanset“epoxylevelalarm”toavoidrunningoutofepoxyduringproductionrun,DispensingMethodTime-Pressure-Vacuum,DispensingMethodTime-Pressure-Vacuum,Musashi,Connecttosyringe,VolumetricDispensingProcessPrinciplePositiveDisplacementSystem(PistonPump)ApplycompressedairPullupthepistontofeedepoxyintothechamberSwitchthevalveportPistonispushedtodispenseepoxy,DispensingMethod-Volumetric,Valve,2-positive-displacementpumpsdispensingCycle,Dispensingfinishesatleftchamberandrightchamberisfilled,Leftchamberisfilledupandrightchamberfinishesdispensing,Valveswitches,DispensingMethod-Volumetric,Valveswitches,Switchingvalve,Pumpbody,Partstobewashed,DispensingMethod-Volumetric,DispensingMethodology,VolumetricDispensingAdvantagesTruepositivedisplacementdispensingNodrippingInconsistencycomesfrompistonpositionerrorandepoxycompressibilityonlyHighaccuracyDrawBacksSlowepoxyfeed-inrateComplicateddesignandlongertime&costlymaintenance,DispensingTool-Writing,Dispenser,L/F,AnvilBlock,Epoxy,DispensingTool-Writing,AprocesstodispensetheepoxyontotheleadframewithprogrammabletrajectorytodrawadispensingpatternaccordingtothegivendiesizeAdoptedtowiderangeofdiesize:
60x601000x1000mils,DispenserX,Y,ZMotion,DispensingTool-Writing,AdvantagesFlexiblefordifferencediesizeEasytocontrolepoxycoverageEasytocontroldietiltandBLTToolsDrawbacksSlowwriting,maydecreaseUPH,DispensingTool-Writing,DispensingTool-Writing,DispensingTool-Writing,L/F,Pad,DispensingToolShowerHead,ShowerHeadDispensingAprocessfordispensingtheepoxyontotheleadframewithafixeddispensingpatternofepoxydotsspeciallydesignedforaparticularrangeofdiesizePractical/applicablerangeofdiesizeforshowerheaddispensing:
30x30150x150mils,DispenserYandZMotion,DispensingToolShowerHead,Advantage:
IncreasingUPHforsmalltomedium-sizediebondingprocessDrawback:
Difficulttoset-uptogetaconsistentresultsforallpadsNozzleholesblockage,DispensedSamples,DispensingToolShowerHead,DispensingMethod-Stamping,AprocessfordispensingtheepoxyontotheleadframewithadispensedepoxydotaccordingtothestampingpinsizeTypicalrangeofdiesizefortheusageofepoxystamping:
7x720x20mils,DispensingToolStampingPin,Tiplength,Tipradius,Stampingpintip,DispensingMethod-Sta
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- Basic Die Bond Process