整理聚酰亚胺薄膜和尺寸稳定及其制备工艺.docx
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整理聚酰亚胺薄膜和尺寸稳定及其制备工艺.docx
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整理聚酰亚胺薄膜和尺寸稳定及其制备工艺
UnitedStatesPatent
4,725,484
三、规划环境影响评价Kumagawa, etal.
February16,1988
Dimensionallystablepolyimidefilmandprocessforpreparationthereof
Abstract
5.定性、定量评价Adimensionallystablepolyimidefilmandprocessesforthepreparationthereof.Thepolyimidefilmiscomposedofanaromaticpolyimideobtainedfromasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamine,whereintheaveragelinearexpansioncoefficientofthepolyimidefilminthetemperaturerangeoffrom50.degree.C.to300.degree.C.is0.1.times.10.sup.-5to2.5.times.10.sup.-5cm/cm..degree.C.,theratioofthelinearexpansioncoefficientinthemachinedirectionofthefilmtothelinearexpansioncoefficientinthetransversedirectionofthefilmisintherangeoffrom1/5to4,andthethermaldimensionstabilityexpressedbytheratioofthechangeofthesizeofthefilmatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedto400.degree.C.fromnormaltemperatureandthefilmismaintainedat400.degree.C.for2hoursislessthan0.3%.
环境影响经济损益分析一般按以下四个步骤进行:
本章中环境影响评价制度,2010年的真题中全部集中在环境影响评价这一节。
环境保护的对象,环境影响评价制度,环境影响评价文件的组成、文件的报批等是历年考试的热点。
Inventors:
1.环境的概念Kumagawa;Kiyoshi(Ube,JP),Kuniyasu;Kenji(Ube,JP),Nishino;Toshiyuki(Ube,JP),Matsui;Yuji(Ube,JP)
Assignee:
(二)环境保护法律法规体系UbeIndustries,Ltd.(Yamaguchi,JP)
(2)环境影响后评价。
Appl.No.:
06/864,299
1.规划环境影响评价的报审Filed:
May16,1986
新增加的六个内容是:
风险评价;公众参与;总量控制;清洁生产和循环经济;水土保持;社会环境影响评价。
(2)评价范围。
根据评价机构专业特长和工作能力,确定其相应的评价范围。
ForeignApplicationPriorityData
May17,1985[JP]
60-103674
May17,1985[JP]
60-103675
CurrentU.S.Class:
428/220;428/473.5;428/901;528/353
CurrentInternationalClass:
C08J5/18 (20060101);B32B027/28 ();B32B027/34 ();C08G069/26 ()
FieldofSearch:
428/473.5,220,901528/353264/212
ReferencesCited[ReferencedBy]
ForeignPatentDocuments
007805
Jan.,1980
JP
0007805
Jan.,1980
JP
PrimaryExaminer:
Herbert;ThomasJ.
Attorney,AgentorFirm:
Burgess,Ryan&Wayne
Claims
Weclaim:
1.Adimensionallystablepolyimidefilmcomposedofanaromaticpolyimideobtainedfromasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamine,whereintheaveragelinearexpansioncoefficientofthepolyimidefilminthetemperaturerangeoffrom50.degree.C.to300.degree.C.is0.1.times.10.sup.-5to2.5.times.10.sup.-3cm/cm..degree.C.,theratio(MD/TD)ofthelinearexpansioncoefficientinthemachinedirection(MDdirection)ofthefilmtothelinearexpansioncoefficientinthetransversedirection(TDdirection)ofthefilmisintherangeoffrom1/5to4,andthethermaldimensionstabilityexpressedbytheratioofthechangeofthesizeofthefilmatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedto400.degree.C.fromnormaltemperatureandthefilmismaintainedat400.degree.C.for2hoursislessthar0.3%.
2.Apolyimidefilmassetforthinclaim1,whichisflexibleandhasathicknessof1to150.mu.m.
3.Apolyimidefilmassetforthinclaim1,whereintheaveragelinearexpansioncoefficientis0.5.times.10.sup.-5to2.3.times.10.sup.-5cm/cm..degree.C.
4.Apolyimidefilmassetforthinclaim1,whereintheMD/TDratioisfrom1/3to3.0.
5.Apolyimidefilmassetforthinclaim1,whereinthethermaldimensionstabilityislessthan0.25%.
6.Apolyimidefilmassetforthinclaim1,whichiscomposedofahigh-molecular-weightaromaticpolyimidecomprisingatleast90mole%ofrecurringunitsrepresentedbythefollowinggeneralformula(I):
##STR3##
7.Apolyimidefilmassetforthinclaim6,whereinthehigh-molecular-weightaromaticpolyimidecomprisesatleast95mole%ofsaidrecurringunits.
8.Apolyimidefilmassetforthinclaim1,whereinthecontentofvolatilecomponentsislowerthan1%byweight.
9.Apolyimidefilmassetforthinclaim8,whereinthecontentofvolatilecomponentsislowerthan0.5%byweight.
Description
BACKGROUNDOFTHEINVENTION
1.FieldoftheInvention
Thepresentinventionrelatestoaprocessforpreparinganaromaticpolyimidefilmhavingexcellentthermaldimensionstabilityfromasolutionofapolyimideprecursor(forexample,anaromaticpolyamicacid)obtainedfromabiphenyl-tetracarboxylicacidandaphenylenediaminebyasolutioncastingmethodorthelike.Moreparticularly,thepresentinventionrelatestoathermallystablearomaticpolyimidefilmhavingahighthermaldimensionstability(oralowthermalsizechange)andanaveragelinearexpansioncoefficientwhichissubstantiallyequaltothelinearexpansioncoefficientofaceramicormetal,andaprocessforthepreparationthereof.
Thispolyimidefilmisveryvaluableasabasefilmofaprintedcircuitboardordinarilyusedforanelectricorelectronicpart.
2.DescriptionoftheRelatedArt
Anaromaticpolyimidefilmobtainedfrompyromelliticdianhydrideandanaromaticdiamineisusedasatypicalinstanceofthearomaticpolyimidefilm.Sincetheaveragelinearexpansioncoefficientofthispolyimidefilmintheunorientedstateisaslargeasabout3.5.times.10.sup.-5toabout4.5.times.10.sup.-5cm/cm..degree.C.,whenthefilmisbondedtoacopperfoilorthelikeatahightemperature,alargeamountofcurlingoccurs.
Asmeansforsolvingthisproblem,GB-A-No.1098556proposesamethodinwhichthedrawingoperationiscarriedoutatthefilm-formingsteptoreducetheaveragelinearexpansioncoefficientofthefilm.However,thefilmobtainedaccordingtothismethodisdefectiveinthattheratioofthechangeofthesizeatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedtoabout400.degree.C.fromnormaltemperatureandthefilmismaintainedatthistemperaturefor2hours(thermaldimensionstability)isverybad,andtherefore,thefilmcannotcopewithincreaseofthewiringdensityinawiringpattern.
SUMMARYOFTHEINVENTION
Researchwasconductedwithaviewtodevelopingaprocessforpreparinganaromaticpolyimidefilmhavingsuchanaveragelinearexpansioncoefficientthatwhenthefilmisbondedtoaceramicormetal(forexample,acopperfoilorcopperalloyfoil)atahightemperature,nolargecurlingoccurs,andalsohavingagoodthermaldimensionstability.Astheresult,itwasfoundthatifathinlayerofasolutionofanaromaticpolyamicacidorthelikeobtainedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineisformedonthesurfaceofasupportandthethinlayerisdriedintwostages,thatis,onthesupportandunderalowtensioninthestateofasolidifiedfilmmemberpeeledfromthesupport,anexcellentaromaticpolyimidefilmhavingaspecificlowlinearexpansioncoefficientandahighthermaldimensionstabilitycanbeobtained.Wehavenowcompletedthepresentinventionbasedonthisfinding.
Morespecifically,inaccordancewiththepresentinvention,thereisprovidedadimensionallystablepolyimidefilmcomposedofanaromaticpolyimideobtainedfromasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamine,whereintheaveragelinearexpansioncoefficientofthepolyimidefilminthetemperaturerangeoffrom50.degree.C.to300.degree.C.is0.1.times.10.sup.-5to2.5.times.10.sup.-5cm/cm..degree.C.,theratio(MD/TD)ofthelinearexpansioncoefficientinthemachinedirection(MDdirection)ofthefilmtothelinearexpansioncoefficientinthetransversedirection(TDdirection)ofthefilmisintherangeoffrom1/5to4,andthethermaldimensionstabilityexpressedbytheratioofthechangeofthesizeofthefilmatnormaltemperatureaftertheheattreatmentwherethetemperatureiselevatedto400.degree.C.fromnormaltemperatureandthefilmismaintainedat400.degree.C.for2hoursislessthanabout0.3%.
Furthermore,inaccordancewiththepresentinvention,thereisprovidedaprocessforthepreparationofadimensionallystablepolyimidefilm,whichcomprisespreparingasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineinanorganicpolarsolvent,formingathinlayerofthesolutiononthesurfaceofasupport,firstdryingthethinlayertoformasolidifiedfilmmemberinwhichthesolventandformedwaterarepresentinanamountof27to60%byweight,peelingthesolidifiedfilmmemberfromthesurfaceofthesupport,seconddryingthefilmmemberunderatensionlowerthan100g/mm.sup.2atatemperatureof80.degree.to250.degree.C.toformasolidifiedfilmwhichcontainsthesolventandformedwaterinanamountof5to25%byweight,anddryingandheat-treatingthesolidifiedfilmatatemperatureof200.degree.to500.degree.C.,whichishigherthansaidseconddryingtemperature,inthestatewhereatleastonepairofboththeoppositeedgesofthefilmarefixed,toformapolyimidefilm.
Thedimensionallystablepolyimidefilmofthepresentinventionmayalsobepreparedbyanotherprocesswhichcomprisespreparingasolutionofapolymerformedbypolymerizationofabiphenyl-tetracarboxylicacidandaphenylenediamineinanorganicpolarsolvent,formingathinlayerofthesolutiononthesurfaceofasupport,dryingthethinlayertoformasolidifiedfilminwhichthesolventandformedwaterarepresentinanamountof20to60%byweight,peelingthesolidifiedfilmfromthesurfaceofthesupport,dryingandheattreatingthesolidifiedfilmatatemperatureof200.degree.to500.degree.C.i
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