印制电路术语总汇Word文档格式.docx
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印制电路术语总汇Word文档格式.docx
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13、多層印製電路板:
mulitlayerprintedcircuitboard
14、多層印製線路板:
mulitlayerpritedwiringboard
15、剛性印製板:
rigidprintedboard
16、剛性單面印製板:
rigidsingle-sidedprintedborad
17、剛性雙面印製板:
rigiddouble-sidedprintedborad
18、剛性多層印製板:
rigidmultilayerprintedboard
19、撓性多層印製板:
flexiblemultilayerprintedboard
20、撓性印製板:
flexibleprintedboard
21、撓性單面印製板:
flexiblesingle-sidedprintedboard
22、撓性雙面印製板:
flexibledouble-sidedprintedboard
23、撓性印製電路:
flexibleprintedcircuit(fpc)
24、撓性印製線路:
flexibleprintedwiring
25、剛性印製板:
flex-rigidprintedboard,rigid-flexprintedboard
26、剛性雙面印製板:
flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted
27、剛性多層印製板:
flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard
28、齊平印製板:
flushprintedboard
29、金屬芯印製板:
metalcoreprintedboard
30、金屬基印製板:
metalbaseprintedboard
31、多重佈線印製板:
mulit-wiringprintedboard
32、陶瓷印製板:
ceramicsubstrateprintedboard
33、導電膠印制板:
electroconductivepasteprintedboard
34、模塑電路板:
moldedcircuitboard
35、模壓印製板:
stampedprintedwiringboard
36、順序層壓多層印製板:
sequentially-laminatedmulitlayer
37、散線印製板:
discretewiringboard
38、微線印製板:
microwireboard
39、積層印製板:
buile-upprintedboard
40、積層多層印製板:
build-upmulitlayerprintedboard(bum)
41、積層撓印製板:
build-upflexibleprintedboard
42、表面層合電路板:
surfacelaminarcircuit(slc)
43、埋入凸塊連印製板:
b2itprintedboard
44、多層膜基板:
multi-layeredfilmsubstrate(mfs)
45、層間全內導通多層印製板:
alivhmultilayerprintedboard
46、載晶片板:
chiponboard(cob)
47、埋電阻板:
buriedresistanceboard
48、母板:
motherboard
49、子板:
daughterboard
50、背板:
backplane
51、裸板:
bareboard
52、鍵盤板夾心板:
copper-invar-copperboard
53、動態撓性板:
dynamicflexboard
54、靜態撓性板:
staticflexboard
55、可斷拼板:
break-awayplanel
56、電纜:
cable
57、撓性扁平電纜:
flexibleflatcable(ffc)
58、薄膜開關:
membraneswitch
59、混合電路:
hybridcircuit
60、厚膜:
thickfilm
61、厚膜電路:
thickfilmcircuit
62、薄膜:
thinfilm
63、薄膜混合電路:
thinfilmhybridcircuit
64、互連:
interconnection
65、導線:
conductortraceline
66、齊平導線:
flushconductor
67、傳輸線:
transmissionline
68、跨交:
crossover
69、板邊插頭:
edge-boardcontact
70、增強板:
stiffener
71、基底:
substrate
72、基板面:
realestate
73、導線面:
conductorside
74、元件面:
componentside
75、焊接面:
solderside
76、印製:
printing
77、網格:
grid
78、圖形:
pattern
79、導電圖形:
conductivepattern
80、非導電圖形:
non-conductivepattern
81、字元:
legend
82、標誌:
mark
二、基材:
1、基材:
basematerial
2、層壓板:
laminate
3、覆金屬箔基材:
metal-cladbadematerial
4、覆銅箔層壓板:
copper-cladlaminate(ccl)
5、單面覆銅箔層壓板:
single-sidedcopper-cladlaminate
6、雙面覆銅箔層壓板:
double-sidedcopper-cladlaminate
7、複合層壓板:
compositelaminate
8、薄層壓板:
thinlaminate
9、金屬芯覆銅箔層壓板:
metalcorecopper-cladlaminate
10、金屬基覆銅層壓板:
metalbasecopper-cladlaminate
11、撓性覆銅箔絕緣薄膜:
flexiblecopper-claddielectricfilm
12、基體材料:
basismaterial
13、預浸材料:
prepreg
14、粘結片:
bondingsheet
15、預浸粘結片:
preimpregnatedbondingsheer
16、環氧玻璃基板:
epoxyglasssubstrate
17、加成法用層壓板:
laminateforadditiveprocess
18、預製內層覆箔板:
masslaminationpanel
19、內層芯板:
corematerial
20、催化板材:
catalyzedboard,coatedcatalyzedlaminate
21、塗膠催化層壓板:
adhesive-coatedcatalyzedlaminate
22、塗膠無催層壓板:
adhesive-coateduncatalyzedlaminate
23、粘結層:
bondinglayer
24、粘結膜:
filmadhesive
25、塗膠粘劑絕緣薄膜:
adhesivecoateddielectricfilm
26、無支撐膠粘劑膜:
unsupportedadhesivefilm
27、覆蓋層:
coverlayer(coverlay)
28、增強板材:
stiffenermaterial
29、銅箔面:
copper-cladsurface
30、去銅箔面:
foilremovalsurface
31、層壓板面:
uncladlaminatesurface
32、基膜面:
basefilmsurface
33、膠粘劑面:
adhesivefaec
34、原始光潔面:
platefinish
35、粗面:
mattfinish
36、縱向:
lengthwisedirection
37、模向:
crosswisedirection
38、剪切板:
cuttosizepanel
39、酚醛紙質覆銅箔板:
phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)
40、環氧紙質覆銅箔板:
epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)
41、環氧玻璃布基覆銅箔板:
epoxidewovenglassfabriccopper-cladlaminates
42、環氧玻璃布紙複合覆銅箔板:
epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates
43、環氧玻璃布玻璃纖維複合覆銅箔板:
epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates
44、聚酯玻璃布覆銅箔板:
ployesterwovenglassfabriccopper-cladlaminates
45、聚酰亞胺玻璃布覆銅箔板:
polyimidewovenglassfabriccopper-cladlaminates
46、雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板:
bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates
47、環氧合成纖維布覆銅箔板:
epoxidesyntheticfiberfabriccopper-cladlaminates
48、聚四乙烯玻璃纖維覆銅箔板:
teflon/fiberglasscopper-cladlaminates
49、超薄型層壓板:
ultrathinlaminate
50、陶瓷基覆銅箔板:
ceramicsbasecopper-cladlaminates
51、紫外線阻擋型覆銅箔板:
uvblockingcopper-cladlaminates
三、基材的材料
1、a階樹脂:
a-stageresin
2、b階樹脂:
b-stageresin
3、c階樹脂:
c-stager
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