MI设计规范文档格式.docx
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MI设计规范文档格式.docx
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内容
Contents
对应页码
Page
5.1材料选配
Materialchoose
2-3
厚度计算
Thicknesscalculate
2
Coverlay胶厚选择
Adhesivethicknessofcoverlaychoose
厂内自配胶基本原则
Matchingprincipleofadhesivebythecompany
材料选配
Materialchoose
3
5.2流程定义
Manufacturingprocess
3-7
基本流程定义
Mainprocess
3-5
流程注意事项定义
Notestopayattention
5-7
5.3资料图纸制作
Drawingmaking
7-11
流程单备注内容
NotesinMI
7-8
图纸资料制作
Drawinginformationmaking
8-11
5.4检查项目
Checkitem
附件一
MIChecklist
六.内容Contents
6.1材料选配Materialchoose
6.1.1厚度计算Thicknesscalculate
6.1.1.1FPC厚度公差±
0.03mm(Min±
0.02mm);
ThethicknesstoleranceofFPCis±
0.02mm).
6.1.1.2FPC+PI补强厚度公差±
0.05mm(Min±
0.03mm);
ThethicknesstoleranceofFPCandPIstiffeneris±
0.03mm).
6.1.1.3FPC+FR4补强厚度公差±
0.1mm;
ThethicknesstoleranceofFPCandFR4is±
0.1mm.
6.1.1.4FPC+钢片补强厚度公差±
ThethicknesstoleranceofFPCandsteelsheetis±
6.1.1.5FPC+背胶厚度公差±
0.05mm;
ThethicknesstoleranceofFPCandtapeis±
0.05mm.
6.1.1.6厚度计算须考虑镀铜厚度,计算时取值单面镀铜厚0.6mil;
Takethethicknessofcopperplatingintoaccountwhencalculate,andchoosethesingleplatingthicknessof0.6mil.
6.1.1.7厚度计算时,Coverlay须扣除溢胶厚度,溢胶量依其胶厚的40%计算;
Deducttheresinthickness(40%oftheadhesivethickness)ofcoverlaywhencalculate.
6.1.1.8背胶厚度为不包括离形纸厚;
Thetapethicknessdoesn’tincludethethicknessofreleasepaper.
6.1.2基材搭配Coverlay之基本原则Principleofmainmaterialmatchcoverlay
6.1.2.1单面板1/3oZ&
1/2oZ铜基材,CoverlayAD厚度可选择0.6mil&
1mil;
Single-side1/3oZ&
1/2oZcoppermatchCoverlayAD0.6mil&
1mil;
6.1.2.2双面板1/3oZ&
1/2oZ铜基材,CoverlayAD厚度可选择1mil;
Double-side1/3oZ&
1/2oZcoppermatchCoverlayAD1mil;
6.1.2.3单,双面板1oZ铜基材,CoverlayAD厚度可选择1mil&
1.4mil;
Singleanddouble-side1oZcoppermatchesCoverlayAD1mil&
1.4mil;
6.1.3厂内自配胶基本原则Matchingprincipleofadhesivebythecompany
6.1.3.1FR4配胶是将胶布于FR4上;
FR4:
GelatinizeontheFR4.
6.1.3.2PET配胶通常为感压胶;
PET:
choosethepressuresensitiveadhesive.
6.1.3.3自配PI补强选材原则;
纯PI+带胶PI+纯胶,不可使用两种带胶PI直接叠成;
PIstiffener:
purePI+PIwithadhesive+pureadhesive,nottochoosetwoPIwithadhesiveatthesametime.
6.1.4材料选配基本原则Principleofmaterialchoose
6.1.4.1压合板接着使用之纯胶应尽量使用1mil之厚度;
Choosetheadhesivethicknessof1milforlaminateboard.
6.1.4.2有动态绕折或屈曲要求之FPC必须使用RA铜;
ChooseRAcopperforflexibleboard.
6.1.4.3线宽线距小于4mil,基材尽量使用薄铜,1/2oZ或1/3oZ铜基材;
Choosethethincopperof1/2oZor1/3oZfortheL/W&
L/Sunder4mil.
6.1.4.4无特殊指定情况下,插拔手指背面补强配PI补强;
ChoosePIstiffeneronbottomoftheinsertfingerunlessspecified.
6.1.4.5无特殊指定情况下,Connector背面补强配FR4补强;
ChooseFR4stiffeneronbottomoftheConnectorunlessspecified.
6.1.4.6无特殊指定情况下,BGA背面补强配钢片补强;
ChooseSTEELSHEETonbottomoftheBGAunlessspecified.
6.1.4.7副材贴合后需过SMT高温焊接之FPC,胶系的使用须考虑是否耐高温;
ChoosethehotresistadhesiveifitneedsSMTaftertacking.
6.1.4.8钢片补强有接地要求(电阻<
1欧姆),建议采用CBF-300热固胶膜+SUS304NST钢片;
ChoosetheCBF-300thermalsettingadhesive+SUS304NSTsteelsheetifthesteelsheetneedstolinktoearth.
6.1.4.9银箔目前有两种规格,SF-PC5000(22um,黑色),SF-PC1000(32um,白色),均可做为防电磁波使用;
Thereare2typesofsilverfoilrecently:
SF-PC5000(22um,black),SF-PC1000(32um,white),ofallareanti-electromagneticwave.
6.1.4.10单面板不可整面印曝光显影型油墨制作,易卷曲;
NottochoosetheLPIforwholepanelprintofsinglesideboard.
6.1.4.11基材搭配Coverlay尽量选用同一供应商;
Choosethesamesupplierofthecopperandcoverlayatonetime.
6.2流程定义DefinitionofManufacturingProcess
6.2.1基本流程定义(只定义出流程中的大站)DefinitionofMainprocess
6.2.1.1单面板基本流程Single-side
开料---钻孔---曝光显影---蚀刻脱膜---贴Coverlay---压制固化---打孔---网印文字---电,化金---加工贴补强---冲型---电测---外形冲型---成检---入库
Shearing–drilling–exposinganddeveloping–etchingandstriping–coverlaytacking–laminatingandsolidifying–targetpunching–silkscreen–Ni/GoldplatingorNi/Goldimmersion–stiffenertacking–punching–electricaltesting–outlinepunching–FQC-warehouse
6.2.1.2纯铜板基本流程Purecopperfoil
开料---钻孔---假贴Base---压制固化---曝光显影---蚀刻脱膜---假贴Coverlay---压制固化---打孔---网印文字---电,化金---加工贴补强---冲型---电测---外形冲型---成检---入库
Shearing–drilling–basecoverlaytacking–laminatingandsolidifying–exposinganddeveloping–etchingandstriping–topsidecoverlaytacking–laminatingandsolidifying–targetpunching–silkscreen-Ni/GoldplatingorNi/Goldimmersion-stiffenertacking–punching–electricaltesting–outlinepunching–FQC-warehouse
6.2.1.3双面板基本流程Double-side
开料---钻孔---沉电铜---曝光显影---蚀刻脱膜---假贴Coverlay---压制固化---打孔---网印文字---电,化金---加工贴补强---冲型---电测---外形冲型---成检---入库
Shearing–drilling–copperplatingorimmersion-exposinganddeveloping–etchingandstriping–coverlaytacking–laminatingandsolidifying–targetpunching–silkscreen–Ni/GoldplatingorNi/Goldimmersion–stiffenertacking–punching–electricaltesting–outlinepunching–FQC-warehouse
6.2.1.4压合板基本流程Laminateboard
开料---一次钻孔---基材压合---二次钻孔---沉电铜---曝光显影---蚀刻脱膜---假贴Coverlay---压制固化---打孔---网印文字---电,化金---加工贴补强---冲型---电测---外形冲型---成检---入库
Shearing–firstdrilling–basefilmtacking–seconddrilling-copperplatingorimmersion-exposinganddeveloping–etchingandstriping–coverlaytacking–laminatingandsolidifying–targetpunching–silkscreen–Ni/GoldplatingorNi/Goldimmersion–stiffenertacking–punching–electricaltesting–outlinepunching–FQC-warehouse
6.2.1.5四层分层板基本流程4-layerboard
开料---一次钻孔---内层基材压合---二次钻孔(内层菲林对位孔)---内层线路曝光显影---内层线路蚀刻脱膜---电测线检---内层Coverlay假贴---压制固化---四层基材压合---打孔(三钻定位孔)---三次钻孔---等离子处理---沉电铜---外层线路曝光显影---外层线路蚀刻脱膜---电测线检---外层Coverlay假贴---压制固化---打孔---网印文字---电,化金---加工贴补强---冲型---电测---外形冲型---成检---入库
Shearing–firstdrilling–innerbasefilmtacking–seconddrilling(innerfilmregistration)–exposinganddevelopingofinnerlayer–etchingandstripingofinnerlayer–electricaltestingofinnerlayer–coverlaytackingofinnerlayer–laminatingandsolidifying–4-layerbasefilmtacking–punching(registrationtooling)–thirddrilling–plasma–copperplatingorimmersion–exposingand
developingofouterlayer–etchingandstripingofouterlayer–electricaltesting–coverlaytackingofouterlayer–laminatingandsolidifying–targetpunching–silkscreen-Ni/GoldplatingorNi/Goldimmersion–stiffenertacking–punching–electricaltesting–outlinepunching–FQC-warehouse
6.2.1.6以上基本流程在Coverlay压制固化前是不可更改,Coverlay压制固化后可根据具体情况适当调整流程
Itcannotbechangetheprocessbeforecoverlaytacking,andcanbeadjusteddependstoactualconditionfortheprocessesaftercoverlaytacking.
6.2.2流程注意事项定义Notestopayattention
6.2.2.1辅助流程定义Definitionofassistantprocess
6.2.2.1.1干膜贴合前使用:
化学清洗;
Beforedryfilmtacking:
chemicaltreatment.
6.2.2.1.2双面板脱膜后进假贴前:
双面磨板处理;
单面板毋须;
Beforecoverlaypre-laminateexceptsingle-side:
brushingtreatmentofbothsides.
6.2.2.1.3黄油丝印前使用:
磨板处理;
Beforeyellowinkprinting:
brushingtreatment.
6.2.2.1.4表面处理前使用:
表面处理喷沙;
Beforesurfacetreatment:
sandspraying.
6.2.2.1.5热固胶系补强贴合前:
板面檫乙醇;
Beforestiffenertackingofthermalsettingadhesive:
wipethesurfacewithalcohol.
6.2.2.1.6BGA板于FQC前:
碱性除油;
BeforeFQCofBGA:
alkalidegreasing.
6.2.2.2流程注意事项Notestopayattention
6.2.2.2.1同时需要电镀Ni~Au和化学Ni~Au两种表面处理流程时,采取先化学Ni~Au,后电镀Ni~Au,即先高温后低温原则;
PuttheNi-AuimmersionbeforetheNi-Auplatingwhentakeuseofthetwoprocessesatthesametime.
6.2.2.2.2同时需要“金”和“锡”两种表面处理时,采取先“金”和“锡”;
PutthegoldplatingbeforeTinplatingwhentakesuseofthegoldandtinplatingatthesametime.
6.2.2.2.3导电银箔或银浆须放置于电镀后制作;
Puttheelectricsilverfoilorsilverpasteaftertheplatingprocess.
6.2.2.2.4需同时贴银箔和印银浆之FPC,须先贴银箔再印银浆;
Putthesilverfoiltackingbeforesilverpasteprintingwhentakeuseofthetwoprocessesatthesametime.
6.2.2.2.5网印文字须排于化金之后;
Putthesilkscreenafterthegoldplatingprocess.
6.2.2.2.6OSP流程须排于电测后,且为整板过OSP;
PuttheOSPprocess(wholepanel)afterelectricaltestingprocess.
6.2.2.2.7打孔流程尽量排于Coverlay压制固化后;
Putthepunchingafterthecoverlaytackingprocess.
6.2.2.2.8针对双面板LPI制作;
Double-sideLPIproduction
a单面开窗阻焊,但需双面印刷黄油时流程:
印刷油墨(无阻焊开窗面)→预烘
→印刷油墨(有阻焊开窗面)→预烘→曝光→后流程
Singlesidesoldermaskopenanddouble-sideyellowinkprinting:
inkprinting(noopen)–prebaks–inkprinting(withopen)–prebaking–exposing-…
b双面开窗阻焊时流程:
正面印刷油墨→预烘→曝光→显影→固化→化学清洗→反面印刷油墨→预烘→曝光→后流程
Double-sideopen:
inkprintingoftopside–prebaking–exposing–developing–solidifying–chemicaltreatment–inkprintingofbottomside–prebaking–exposing-…
6.2.2.2.10针对PI补强的贴合与压制;
PIstiffenertackingandlaminating
a3mil及以下PI补强,流程:
Coverlay假贴后→PI补强假贴→一起压制固化;
3milandunder3mil:
coverlaytacking–PIstiffenertacking–laminatingandsolidifyingtogether.
b3mil以上PI补强,不可与Coverlay一起压制固化,须单独压制固化;
Above3mil:
laminatingandsolidifyingseparately.
6.2.2.2.11钢片补强尽量于外形冲型后,单PCS贴合;
Tackthesteelsheetpiecebypieceafteroutlinepunching.
6.2.2.2.12当钢片于外型冲型前贴合时时流程:
穴拔冲型(钢片贴合处)→贴钢片→外
形冲型(模具须将钢片处挖开);
Tackbeforeoutlinepunching:
punching–steelsheettacking–outlinespunching.
6.2.2.2.130.2mmFR4可条贴后与FPC一起成型;
RouttogetherwithFPCfortheFR4lessthan0.2mm
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