PCB工艺术语.docx
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PCB工艺术语.docx
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PCB工艺术语
*ProcessModule说明:
A.下料(CutLamination)
a-1裁板(SheetsCutting)
a-2原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)
b-1内钻(InnerLayerDrilling)
b-2一次孔(OuterLayerDrilling)
b-3二次孔(2ndDrilling)
b-4雷射钻孔(LaserDrilling)(LaserAblation)
b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)C.乾膜制程(PhotoProcess(D/F))
c-1前处理(Pretreatment)
c-2压膜(DryFilmLamination)
c-3曝光(Exposure)
c-4显影(Developing)
c-5蚀铜(Etching)
c-6去膜(Stripping)
c-7初检(Touch-up)
c-8化学前处理,化学研磨(ChemicalMilling)
c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)
c-10显影(Developing)
c-11去膜(Stripping)
D.压合Lamination
d-1黑化(BlackOxideTreatment)
d-2微蚀(Microetching)
d-3铆钉组合(eyelet)
d-4叠板(Layup)
d-5压合(Lamination)
d-6后处理(PostTreatment)
d-7黑氧化(BlackOxideRemoval)
d-8铣靶(spotface)
d-9去溢胶(resinflushremoval)
E.减铜(CopperReduction)
e-1薄化铜(CopperReduction)
F.电镀(HorizontalElectrolyticPlating)
f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)
f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)
f-3低於1mil(Lessthan1milThickness)
f-4高於1mil(Morethan1milThickness)
f-5砂带研磨(BeltSanding)
f-6剥锡铅(Tin-LeadStripping)
f-7微切片(Microsection)
G.塞孔(PlugHole)
g-1印刷(InkPrint)
g-2预烤(Precure)
g-3表面刷磨(Scrub)
g-4后烘烤(Postcure)
H.防焊(绿漆):
(SolderMask)
h-1C面印刷(PrintingTopSide)
h-2S面印刷(PrintingBottomSide)
h-3静电喷涂(SprayCoating)
h-4前处理(Pretreatment)
h-5预烤(Precure)
h-6曝光(Exposure)
h-7显影(Develop)
h-8后烘烤(Postcure)
h-9UV烘烤(UVCure)
h-10文字印刷(PrintingofLegend)
h-11喷砂(Pumice)(WetBlasting)
h-12印可剥离防焊(PeelableSolderMask)
I.镀金Goldplating
i-1金手指镀镍金(GoldFinger)
i-2电镀软金(SoftNi/AuPlating)
i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)
J.喷锡(HotAirSolderLeveling)
j-1水平喷锡(HorizontalHotAirSolderLeveling)
j-2垂直喷锡(VerticalHotAirSolderLeveling)
j-3超级焊锡(SuperSolder)
j-4.印焊锡突点(SolderBump)
K.成型(Profile)(Form)
k-1捞型(N/CRouting)(Milling)
k-2模具冲(Punch)
k-3板面清洗烘烤(Cleaning&Backing)
k-4V型槽(V-Cut)(V-Scoring)
k-5金手指斜边(BevelingofG/F)
L.短断路测试(ElectricalTesting)(Continuity&InsulationTesting)
l-1AOI光学检查(AOIInspection)
l-2VRS目检(Verified&Repaired)
l-3泛用型治具测试(UniversalTester)
l-4专用治具测试(DedicatedTester)
l-5飞针测试(FlyingProbe)
M.终检(FinalVisualInspection)
m-1压板翘(WarpageRemove)
m-2X-OUT印刷(X-OutMarking)
m-3包装及出货(Packing&shipping)
AbieticAcid松脂酸.
AbrasionResistance耐磨性.
Abrasives磨料,刷材.
ABS树脂.
Absorption吸收(入).
AcImpedance交流阻抗.
AcceleratedTest(Aging)加速老化(试验).
Acceleration速化反应.
Accelerator加速剂,速化剂.
Acceptability,Acceptance允收性,允收.
AccessHole露出孔,穿露孔.
Accuracy准确度.
AcidNumber(AcidValue)酸值.
AcousticMicroscope(AM)感音成像显微镜.
Acrylic压克力(聚丙烯酸树脂).
ActinicLight(orIntensity,orRadiation)有效光.
Activation活化.
Activator活化剂.
ActiveCarbon活性炭.
ActiveParts(Devices)主动零件.
Acutance解像锐利度.
AdditionAgent添加剂.
AdditiveProcess加成法.
Adhesion附着力.
AdhesionPromotor附着力促进剂.
Adhesive胶类或接着剂.
Admittance导纳(阻抗的倒数).
Aerosol喷雾剂,气熔胶,气悬体.
Aging老化.
AirInclusion气泡夹杂.
AirKnife风刀.
Algorithm算法.
AliphaticSolvent脂肪族溶剂.
AluminiumNitride(AlN)氮化铝.
AmbientTamp环境温度.
Amorphous无定形,非晶形.
Amp-Hour安培小时.
AnalogCircuit/AnalogSignal模拟电路/模拟讯号.
AnchoringSpurs着力爪.
Angleof Contack接触角.
AngleofAttack攻角.
Anion阴离子.
Anisotropic异向性,单向的.
Anneal韧化(退火).
AnnularRing孔环.
Anode阳极.
AnodeSludge阳极泥.
Anodizing阳极化.
ANSI美国标准协会.
Anti-FoamingAgent消泡剂.
Anti-pitAgent抗凹剂.
AOI自动光学检验.
Apertures开口,钢版开口.
AQL品质允收水准.
AQL(AcceptableQualityLevel)允收品质水准.
AramidFiber聚醯胺纤维.
ArcResistance耐电弧性.
Array排列.
Artwork底片.
ASIC特定用途绩体电路器.
AspectRatio纵横比.
Assembly组装装配.
A-stageA阶段.
ATE自动电测设备.
Attenuation讯号衰减.
Autoclave压力锅.
Axial-lead轴心引脚.
Azeotrope共沸混合液.
*****B*****
BackLight(BackLighting)背光法.
BackTaper反锥斜角.
Backpanels,Backplanes支撑板.
Back-up垫板.
BalancedTransmissionLines平衡式传输线.
BallGridArray球脚数组(封装).
Bandability弯曲性.
BankingAgent护岸剂.
BareChipAssembly裸体芯片组装.
Barrel孔壁,滚镀.
BaseMaterial基材.
BasicGrid基本方格.
Batch批.
Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr)
凡液体比重比水轻则 Be=140÷(Sp.Gr-130)
*Sp.Gr为比重即同体绩物质对"纯水"1g/cm的比值).
Beamlead光芒式的平行密集引脚.
Bed-of-NailTesting针床测试.
BellowsConact弹片式接触.
BetaRayBackscatter贝他射线反弹散射.
Bevelling切斜边.
Bias斜张纲布,斜纤法.
Bi-LevelStencil]双阶式钢板.
Binder粘结剂.
Bits头(DrillBits).
BlackOxide黑氧化层.
Blanking冲空断开.
Bleack漂洗.
Bleeding溢流.
BlindViaHole肓通孔.
Blister局部性分层或起泡.
BlockDiagram电路系统块图.
Blockout封纲.
Blotting干印.
BlottingPaper吸水纸.
BlowHole吹孔.
BluePlaque蓝纹(锡面钝化层).
BlurEdge(Circle)模糊边带(圈).
BombSight弹标.
BondStrength结合强度.
Bondability结合性.
BondingLayer结合层接着层.
BondingSheet(Layer)接合片.
BondingWire结合线.
Bow,Bowing板弯.
Braid编线.
Brazing硬焊(用含银的铜锌合金焊条).
在425℃~870℃下进行熔接的方式).
BreakPoint显像点.
Break-awayPanel可断开板.
BreakdownVoltage崩溃电压.
Break-out破出.
Bridging搭桥.
BrightDip光泽浸渍处理.
Brightener光泽剂.
BrownOxide棕氧化.
BrushPlating刷镀.
B-stageB阶段.
BuildUpProcess增层法制程.
Build-up堆积.
Bulge鼓起.
Bump突块.
BumpingProcess凸块制程.
Buoyancy浮力.
BuriedViaHole埋导孔.
Burn-in高温加速老化试验.
Burning烧焦.
Burr毛头.
BusBar汇电杆.
ButterCoat外表树脂层.
*****C*****
C4ChipJointC4芯片焊接.
Cable电缆.
CAD计算机辅助设计.
CalenderedFabric轧平式纲布.
CapLamination帽式压合法.
Capacitance电容.
CapacitiveCoupling电容耦合.
CapillaryAction毛细作用.
Carbide碳化物.
CarbonArcLamp碳弧灯.
CarbonTreatment,Active活化炭处理.
Card卡板.
CardCages/CardRacks电路板构装箱.
CarlsonPin卡氏定位稍.
Carrier载体.
Cartridge滤心.
Castallation堡型绩体电路器.
CatalyzedBoard,CatalyzedSubstrate催化板材.
Catalyzing催化.
Cathode阴极.
Cation阴向离子,阳离子.
CaulPlate隔板.
Cavitation空泡化 半真空.
Center-to-CenterSpacing中心间距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate证明书.
CFC氟氢碳化物.
Chamfer倒角.
CharacteristicImpedance特性阻抗.
Chase纲框.
CheckList检查清单.
Chelate螯合.
ChemicalMilling化学研磨.
ChemicalResistance抗化性.
Chemisorption化学吸附.
Chip芯片(粒).
ChipInterconnection芯片互连.
ChiponBoard芯片粘着板.
ChipOnGlass晶玻接装(COG).
Chisel钻针的尖部.
ChlorinatedSolvent含氯溶剂,氯化溶剂.
CircumferentialSeparation环状断孔.
Clad/Cladding披覆.
CleanRoom无尘室.
Cleanliness清洁度.
Clearance余地,余环.
ClinchedLeadTerminal紧箝式引脚.
Clinched-wireThroughConnection通孔弯线连接法.
ClipTerminal绕线端接.
Coat,Coating皮膜表层.
CoaxialCable同轴缆线.
CoefficientofThermalExpansion热膨胀系数.
Co-Firing共绕.
ColdFlow冷流.
ColdSolderJoint冷焊点.
CollimatedLight平行光.
Colloid胶体.
ColumnarStructure柱状组织.
CombPattern梳型电路.
ComplexIon错离子.
ComponentHole零件孔.
ComponentOrientation零件方向.
ComponentSide组件面.
Composites,(CEM-1,CEM-3)复合板材.
CondensationSoldering凝热焊接,液化放热焊接.
Conditioning整孔.
Conductance导电.
ConductiveSalt导电盐.
Conductivity导电度.
ConductorSpacing导体间距.
ConformalCoating贴护层.
Conformity吻合性,服贴性.
Connector连接器.
ContactAngle接触角.
ContactArea接触区.
ContactResistance接触电阻.
Continuity连通性.
ContractService协力厂,分包厂.
ControlledDepthDrilling定深钻孔.
ConversionCoating转化皮膜.
Coplanarity共面性.
Copolymer共聚物.
CopperFoil铜皮.
CopperMirrorTest铜镜试验.
CopperPaste铜膏.
Copper-Invar-Copper(CIC)综合夹心板.
CoreMaterial内层板材,核材.
CornerCrack通孔断角.
CornerMark板角标记.
Counterboring方型扩孔.
Countersinking锥型扩孔.
CouplingAgent偶合剂.
Coupon,TestCoupon板边试样.
Coverlay/Covercoat表护层.
Crack裂痕.
Crazing白斑.
Crease皱折.
Creep潜变.
CrossectionArea截面积.
CrosshatchTesting十字割痕试验.
Crosshatching十字交叉区.
Crosslinking,Crosslinkage交联,架桥.
Crossover越交,搭交.
Crosstalk噪声,串讯.
CrystallineMeltingPoint晶体熔点.
C-StageC阶段.
Cure硬化,熟化.
CurrentDensity电流密度.
Current-CarryingCapability载流能力.
CurtainCoating濂涂法.
*****D*****
DaisyChainedDesign菊瓣设计.
DatumReference基准参考.
DaughterBoard子板.
Debris碎屑,残材.
Deburring去毛头.
DeclinationAngle斜射角.
Definition边缘逼真度.
Degradation劣化.
Degrasing脱脂.
DeionizedWater去离子水.
Delamination分离.
DendriticGrowth枝状生长.
Denier丹尼尔(是编织纺织所用各种纱类直径单位,
定义9000米纱束所具有的重量(以克米计)).
Densitomer透光度计.
Dent凹陷.
Deposition皮膜处理.
Desiccator干燥器.
Desmearing去胶渣.
Desoldering解焊.
Developer显像液,显像机.
Developing显像.
Deviation偏差.
Device电子组件.
Dewetting缩锡.
D-glassD玻璃.
DiazeFilm偶氮棕片.
Dichromate重铬酸盐.
Dicing芯片分割.
Dicyandiamide(Dicy)双氰胺.
Die冲模.
DieAttach晶粒安装.
DieBonding晶粒接着.
DieStamping冲压.
Dielectric介质.
DielectricBreakdownVoltage介质崩溃电压.
DielectricConstant介质常数.
DielectricStrength介质强度.
DifferentialScanningCalorimetry(DSC)微差扫瞄热卡分析法.
DiffusionLayer扩散层.
Digitizing数字化.
DihedralAngle双反斜角.
DimensionalStability尺度安定性.
Diode二极管.
DipCoating浸涂法.
DipSoldering浸焊法.
DIP(DualInlinePackage)双排脚封装体.
Dipole偶极,双极.
Direct/IndirectStencil直接/间接版膜.
DirectEmulsion直接乳胶.
DirectPlating直接电镀.
DiscreteCompenent散装零件.
DiscreteWiringBoard散线电路板,复线板.
DishDown碟型下陷.
Dispersant分散剂.
DissipationFactor散失因素.
DisspationFactor散逸因子.
DisturbedJoint受扰焊点.
DoctorBlade修平刀,刮平刀.
DogEar狗耳.
Doping掺杂.
DoubleLayer双电层.
DoubleTreatedFoil双面处理铜箔.
DragIn/DragOut带[进/带出.
DragSoldering拖焊.
Drawbridging吊桥效应.
Drift漂移.
DrillFacet钻尖切削面.
DrillPointer钻针重磨机.
DrilledBlank已钻孔的裸板.
Dross浮渣.
DrumSide铜箔光面.
DryFilm干膜.
DualWaveSoldering双波焊接.
Ductility展性.
DummyLand假焊垫.
Dummy,Dummying假镀(片).
Durometer橡胶硬度计.
DYCOstrate电浆蚀孔增层法.
DynamicFlex(FPC)动态软板.
*****E*****
E-Beam(ElectronBeam)电子束.
EddyCurrent涡电流.
EdgeSpacing板边空地.
Edge-BoardConnector板边(金手指)承接器.
Edge-BoardContact板边金手指.
Edge-DipSolderabilityTest板边焊锡性测试.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass电子级玻璃.
Elastomer弹性体.
ElectricStrength(耐)电性强度.
Electrodeposition电镀.
Electro-depositionPhotoresist电着光阻,电泳光阻.
Electroforming电铸.
Electroless-Deposition无电镀.
ElectrolyticToughPitch电解铜..
Electrolytic-Cleaning电解清洗.
Electro-migration电迁移.
Electro-phoresis电泳动,电渗.
Electro-tinning镀锡.
Electro-Winning电解冶炼.
Elongation延伸性,延伸率.
Embossing凸出性压花.
EMF(ElectromotiveForce)电动势.
EMI(ElectromagneticInterference)电磁干扰.
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